Display Substrate Double-Layer Wiring for Touch and Power Routing
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Solution Overview
Problem
Existing display technologies face challenges in efficiently integrating double-layer wiring structures and power supply lines in display substrates, particularly in flexible OLED and QLED devices, which affect the reliability and performance of the display apparatus.
Innovation Solution
A display substrate design featuring a double-layer wiring structure with overlapping power supply lines connected through grooves or via holes in the insulating layer, ensuring electrical connectivity and minimizing overlap with isolation dams, while maintaining flexibility and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power supply lines are arranged in overlapping areas between source-drain metal layer and touch metal layer, then electrical connectivity is enhanced, but interference between wiring layers increases
Solution Approach 1:
The patent utilizes the vertical dimension by creating a double-layer wiring structure where power supply lines are positioned in overlapping areas between the source-drain metal layer and touch metal layer. This three-dimensional arrangement enhances electrical connectivity by providing multiple conduction paths while managing interference through spatial separation in the vertical dimension.
Solution Approach 2:
The patent applies local quality by positioning power supply lines specifically in overlapping areas between different metal layers rather than uniformly distributing them. This localized arrangement optimizes electrical connectivity in critical regions while minimizing overall interference between wiring layers through selective placement.
2Reliability
If double-layer wiring structure is integrated, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the wiring structure into distinct layers (source-drain metal layer and touch metal layer) with power supply lines positioned in overlapping areas between them. This segmentation allows for improved electrical connectivity through multiple conduction paths while managing manufacturing complexity by organizing conductors into separate, manageable layers that can be processed independently.
3Reliability
If power supply lines extend through fan-out region and bonding pin region, then electrical connectivity is enhanced, but overlap with isolation dams increases
Solution Approach 1:
The patent extends power supply lines through the fan-out region and bonding pin region in the vertical dimension, positioning them between metal layers to achieve enhanced electrical connectivity while managing spatial relationships with isolation dams through three-dimensional routing.
Solution Approach 2:
The patent applies local quality by extending power supply lines through specific regions (fan-out region and bonding pin region) where enhanced connectivity is needed, while carefully managing overlap with isolation dams through selective positioning in overlapping areas between metal layers.
Data Source
AI summary
A display substrate and a preparation method thereof, and a display apparatus, wherein on a plane perpendicular to the display substrate, the display substrate includes a source-drain metal layer located on a base substrate, an insulating layer located on the source-drain metal layer, and a touch metal layer located on the insulating layer, the source-drain metal layer includes a first wiring, the touch metal layer includes a second wiring, there is an overlapping area between an orthographic projection of the first wiring on the base substrate and an orthographic projection of the second wiring on the base substrate; and the first wiring and the second wiring form a double-layer wiring structure.