Stepped Display Substrate Layout for Low-Dispersion Etching
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Solution Overview
Problem
The manufacturing process of display devices generates etching byproducts, leading to increased etching dispersion and reduced efficiency in substrate processing.
Innovation Solution
The display device design includes a second substrate with a first sub-substrate and a second sub-substrate, where the first sub-substrate has a first surface adjacent to the second substrate and a second surface opposite to the first surface, forming an obtuse angle with a side directed toward the bending area. This design minimizes etching byproducts and reduces etching dispersion by controlling the etching process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching process is used on substrate, then substrate can be processed, but etching byproducts are generated causing increased etching dispersion
Solution Approach 1:
The substrate is divided into multiple regions with different thicknesses, creating a stepped structure. This segmentation allows the etching process to be performed at different depths in different regions, enabling precise control of etching byproducts generation and their removal paths.
Solution Approach 2:
The invention introduces a vertical dimension by creating a stepped substrate structure with different thickness levels. This dimensional change provides a height difference that facilitates the removal of etching byproducts from specific regions, reducing dispersion and improving manufacturing precision.
2Productivity
If substrate thickness is reduced to minimize byproducts, then etching efficiency improves, but substrate structural integrity may be compromised
Solution Approach 1:
Different regions of the substrate are given different thicknesses according to their specific functional requirements. The stepped structure allows local optimization where etching is needed while maintaining sufficient thickness in other areas to preserve overall structural integrity.
Solution Approach 2:
The substrate is segmented into multiple thickness levels, allowing etching operations to be performed efficiently in specific regions without compromising the structural strength of the entire substrate. The stepped design enables selective thinning for byproduct removal while maintaining strength where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively suppresses etching byproducts, reducing etching dispersion and enhancing the manufacturing efficiency of display devices by optimizing the substrate processing.
Implementation Method 1
forming a cutting line on the first mother substrate and the second mother substrate by irradiating a laser along a boundary of edges of the display cells
Implementation Method 2
reducing a thickness of the first mother substrate by spraying an etchant onto the lower surface of the first mother substrate without a mask, and substantially concurrently removing a portion of the first mother substrate that overlaps the bending area
Data Source
AI summary
There is provided a display device including a second substrate corresponding to a main area, a pad area, and a bending area between the main area and the pad area, a first substrate at the main area and at the pad area and beneath the second substrate, and a display element layer at the main area and above the second substrate, wherein the first substrate includes a first sub-substrate overlapped with the main area, and including a first surface adjacent the second substrate, a second surface opposite to the first surface, and a first side directed toward the bending area, and a second sub-substrate spaced apart from the first sub-substrate and overlapped with the pad area, wherein a first inclined angle formed by the second surface and the first side is an obtuse angle.