Display Substrate Fan-Out Wiring for Reduced Wire Breakage
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Solution Overview
Problem
The wires in the fan-out region of display substrates are prone to breaking, leading to display abnormalities and reduced product yield due to their high density and complex arrangement.
Innovation Solution
The display substrate design includes a ratio of transfer line width to fan-out wire width of 0.5 to 5.5, with specific configurations of connecting portions and layers to enhance structural integrity and reduce breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the wire density and arrangement complexity in the fan-out region are increased to support higher screen resolution, then the display resolution is improved, but the wires become more prone to breaking and reliability deteriorates
Solution Approach 1:
The patent divides the wire structure into multiple segments: fan-out wires in the fan-out region and data signal lines in the bending region, connected through transfer lines. This segmentation allows each component to be optimized independently - the fan-out wires can be densely arranged for high resolution while the transfer lines provide reinforced connections to maintain reliability.
Solution Approach 2:
The patent applies different structural characteristics to different regions: the fan-out region has densely arranged fan-out wires for high resolution, while the bending region has data signal lines with specific width ratios (0.5 to 5.5 times the fan-out wire width) to enhance reliability. Each region's wire structure is locally optimized for its specific function.
2Measurement precision
If the wire arrangement in the fan-out region is made more complex to accommodate higher resolution, then the display quality is improved, but the manufacturing difficulty increases
Solution Approach 1:
By segmenting the wire structure into distinct fan-out wires and data signal lines connected through transfer lines, the patent simplifies the manufacturing process. Each segment can be fabricated using standardized procedures, reducing the overall manufacturing complexity despite the high resolution requirements.
Solution Approach 2:
The patent specifies precise parameter ranges for wire widths (transfer line width to fan-out wire width ratio of 0.5 to 5.5) and geometric configurations (angles between connecting portions). These standardized parameters enable consistent manufacturing across different batches while supporting high display resolution.
3Measurement precision
If the wire density in the fan-out region is increased to support higher resolution, then the display performance is improved, but the product yield is reduced due to increased breakage
Solution Approach 1:
The segmented wire structure with dedicated transfer lines connecting fan-out wires to data signal lines provides reinforced pathways that reduce breakage. This segmentation allows high wire density in the fan-out region while maintaining structural integrity through the transfer line connections, thereby improving product yield.
Solution Approach 2:
The patent enhances local structural quality at critical connection points by designing transfer lines with specific width ratios (0.5 to 5.5 times the fan-out wire width). This local reinforcement reduces breakage probability in high-stress areas, maintaining high display resolution while improving overall product yield.
Data Source
AI summary
A display substrate and a display apparatus are provided. The display substrate includes: a display region and a non-display region, the non-display region including a fan-out region and a bending region; a plurality of sub-pixels located in the display region; a plurality of first data signal lines located in the display region and electrically connected with the plurality of sub-pixels; a plurality of fan-out wires located in the fan-out region; a plurality of second data signal lines located in the bending region; and a plurality of transfer lines located in the fan-out region and between the plurality of fan-out wires and the plurality of second data signal lines, wherein a ratio of a width of at least part of the plurality of transfer lines to a width of the plurality of fan-out wires is 0.5 to 5.5.