Display Substrate Power-Line Spacing for Frit-Glue Encapsulation

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Solution Overview

Problem

The encapsulation of OLED display devices using frit glue and an encapsulation cover plate is inadequate in preventing moisture and oxygen ingress, leading to corrosion and reduced service life due to shrinkage of the frit glue during laser sintering, which compromises the encapsulation effect.

Innovation Solution

A display substrate design with specific spacing and arrangement of power source lines and fanout lines, along with dummy signal lines, to increase adhesion area and strength of frit glue, reducing flatness and preventing electrochemical corrosion without additional layers or process improvements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If frit glue is used for encapsulation, then the display device can be protected from corrosion, but the frit glue shrinks during laser sintering which compromises the encapsulation effect

Engineering Contradiction:
Improveencapsulation effectVSAvoidfrit glue shrinkage
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by creating different spacing regions (first spacing region with larger distance, second spacing region with smaller distance) in different areas of the power source line structure. This local variation in spacing increases the adhesion area of the frit glue in specific regions, thereby improving the encapsulation effect without requiring changes to the entire structure or additional materials.

Inventive Principle:
Principle #3Local quality

2Area of stationary object

If power source lines are arranged close together to reduce device size, then the display device becomes more compact, but the adhesion area of frit glue is reduced leading to encapsulation failures

Engineering Contradiction:
Improvedevice sizeVSAvoidencapsulation effectiveness
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent introduces a vertical dimension to the spacing arrangement by defining first and second spacing regions at different locations relative to the encapsulation adhesive region. The first spacing region is positioned to overlap with the encapsulation adhesive region, while the second spacing region is positioned away from it. This spatial arrangement in multiple dimensions allows for increased adhesion area without proportionally increasing the overall device footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If additional encapsulation layers are added to improve protection, then the encapsulation effect is enhanced, but the manufacturing complexity and process difficulty increase

Engineering Contradiction:
Improveprotection from moisture and oxygenVSAvoidencapsulation structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies self-service by designing the power source line structure itself to provide the encapsulation function. The specific spacing arrangement of the power source lines creates adhesion areas that enable the frit glue to bond effectively, allowing the existing structure to serve dual purposes: electrical connection and encapsulation protection. This eliminates the need for separate encapsulation layers or additional process steps.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the encapsulation effect by ensuring effective adhesion of frit glue, reducing shrinkage, and preventing moisture and oxygen ingress, thereby extending the display device's service life and reducing encapsulation failures.

Implementation Method 1

increase adhesion area and strength of frit glue

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

during laser sintering

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 3

during laser sintering

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS20250301873A1Display substrate, manufacturing method thereof, and display device
Publication Date: 2025.09.25 BOE TECHNOLOGY GROUP CO LTD
  • US20250301873A1 patent drawing
  • US20250301873A1 patent drawing
  • US20250301873A1 patent drawing

AI summary

A display substrate, a manufacturing method and a display device. In the display substrate, a first power source line includes a transmission portion and a first inlet portion coupled to the transmission portion, the transmission portion is arranged between a display region and the first inlet portion and extends in a first direction, and at least a part of the first inlet portion extends in a second direction. A second power source line includes a peripheral portion and two second inlet portions, the peripheral portion is provided with an opening, and two ends of the peripheral portion at the opening are coupled to the two second inlet portions respectively. The first inlet portion is arranged between the two second inlet portions, a first spacing region and a second spacing region are arranged between each second inlet portion and the first inlet portion.