Display Substrate Grooved Protective Layer for Narrow Bezel Side Bonding
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Solution Overview
Problem
The existing Outer Lead Bonding (OLB) method in TFT-LCD displays results in obstacles for narrow bezels due to exposed leads and requires a certain width for bonding, while the new Side Bonding technology is prone to metal lead damage during grinding, affecting bonding efficiency.
Innovation Solution
A display substrate with a bonding region featuring a first protective layer with a groove to house and protect the bonding electrode, where the protective layer's hardness is less than the electrode's, made of organic material, and a second protective layer on the side of the bonding electrode to prevent damage during cutting and grinding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If side bonding technology is used to expose metal leads through side grinding, then bezel width is reduced, but metal leads are prone to damages during grinding
Solution Approach 1:
The patent applies preliminary action by forming a protective film layer on the metal lead before side grinding. This protective layer is prepared in advance to prevent damage during the subsequent grinding process, allowing the metal lead to be exposed while maintaining its integrity
Solution Approach 2:
The patent uses an intermediary approach by introducing a protective film layer as a mediator between the metal lead and the grinding process. This film layer acts as a protective intermediary that prevents direct contact between the grinding tool and the metal lead, thereby avoiding damage while still allowing the lead to be exposed for bonding
2Ease of operation
If outer lead bonding method is used with exposed leads, then drive signals can be input into the panel, but bezel width increases due to required bonding width
Solution Approach 1:
The patent applies dimensionality change by transitioning from outer lead bonding (which requires horizontal space for exposed leads and bonding width) to side bonding (which utilizes the vertical/side dimension). The metal lead is exposed through side grinding and bonded from the side, eliminating the need for horizontal bonding space and enabling narrower bezels while maintaining signal input capability
Data Source
AI summary
Provided is a display substrate, a manufacturing method thereof and a display panel. The display substrate includes a base substrate, a display region and a bonding region located at a side of the display region on the base substrate, wherein the bonding region includes a first protective layer and a bonding electrode disposed on the base substrate; the first protective layer is provided with a groove; the bonding electrode is at least partially disposed in the groove; in a direction parallel to the base substrate, the groove, the bonding electrode and the first protective layer extend to an edge of the bonding region in a direction away from the display region; and a material of the first protective layer is less hard than a material of the bonding electrode.