Display Substrate Groove Buffer for Electrostatic Breakdown Prevention

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Solution Overview

Problem

In high-resolution display devices, particularly those using Low Temperature Poly Silicon (LTPS) technology, metal driving lines such as gate and data lines often cross each other, leading to electrostatic breakdown and Data-Gate Short (DGS) issues due to sharp ends, causing display abnormalities and reliability concerns.

Innovation Solution

A display substrate design featuring a first conductive line and a second conductive line with an insulation layer and a buffer layer, where the first conductive line is placed in a groove within the buffer layer, ensuring its surface is flush with the buffer layer, preventing sharp ends and electrostatic breakdown by maintaining parallel contact with the substrate, and optionally incorporating a support pattern to enhance signal transmission and prevent short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If metal driving lines cross each other in high-resolution display devices, then the display resolution and driving capability are improved, but electrostatic breakdown and Data-Gate Short issues occur due to sharp ends

Engineering Contradiction:
Improvedisplay resolutionVSAvoidelectrostatic breakdown resistance
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent applies curvature by replacing the sharp end structure with a rounded or curved end structure for the first conductive line. This curvature modification eliminates the concentration of electric field at sharp corners, thereby preventing electrostatic breakdown and Data-Gate Short issues while maintaining the crossing configuration necessary for high-resolution display driving.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent implements preliminary action by pre-forming a groove structure in the insulation layer before depositing the first conductive line. This groove structure is designed in advance to guide the conductive line into a specific curved path, ensuring that the sharp end problem is prevented from the outset rather than addressed after the conductive line is formed.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If a groove structure is formed in the buffer layer to accommodate the first conductive line, then sharp ends are prevented and electrostatic breakdown is avoided, but the manufacturing process complexity increases

Engineering Contradiction:
Improveelectrostatic breakdown resistanceVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into the groove structure: it serves as both the embedding structure for the conductive line and the curvature-guiding structure simultaneously. By combining these functions, the design achieves electrostatic breakdown prevention without requiring separate curvature-inducing structures, thereby reducing overall manufacturing complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The groove structure acts as an intermediary element between the buffer layer and the first conductive line. It mediates the interaction by providing a pre-formed curved path that naturally guides the conductive line into the desired shape, eliminating the need for complex post-processing or additional curvature-control structures.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the surface of the first conductive line is made flush with the buffer layer surface, then flat contact surface is achieved for proper insulation, but additional manufacturing steps are required

Engineering Contradiction:
Improveinsulation qualityVSAvoidmanufacturing steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-forming the groove structure with the exact depth required to accommodate the conductive line such that its surface becomes flush with the buffer layer. This pre-planned depth specification eliminates the need for additional planarization steps, as the flush surface is achieved during the groove formation process itself.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses parameter changes by precisely controlling the groove depth parameter during formation. By setting the groove depth to match the conductive line thickness, the design ensures that the conductive line surface automatically becomes flush with the buffer layer surface, achieving proper insulation contact without requiring additional manufacturing steps.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11700688B2Display substrate, method for manufacturing the same and display device
Publication Date: 2023.07.11 HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
  • US11700688B2 patent drawing
  • US11700688B2 patent drawing
  • US11700688B2 patent drawing

AI summary

The present disclosure provides a display substrate, a method for manufacturing the display substrate, and a display device. The display substrate includes a first conductive line extending in a first direction on a base substrate, a second conductive line extending in a second direction crossing the first direction on the base substrate, and an insulation layer arranged between the first conductive line and the second conductive line. The display substrate further includes a buffer layer arranged between the first conductive line and the base substrate, a groove extending in the first direction is formed in the buffer layer, the first conductive line is arranged in the groove, and a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate.