Display Substrate Groove for Laser Sintering Airtightness
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Solution Overview
Problem
The existing display device packaging process often results in poor airtightness due to incomplete sintering of the sealing material, leading to corrosion and reduced reliability of sensitive components, especially when laser irradiation fails to evenly reach the edges of the sealing material, causing burr-like side faces and invalid package areas.
Innovation Solution
A display substrate with an interlayer insulating layer featuring a groove that directs laser light onto the sealing material, ensuring even sintering by reflecting light from the groove's side walls onto the sealing material, which can be a frit or UV glue, thereby enhancing the airtightness of the package area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser irradiation is used to sinter sealing material at package area edges, then packaging airtightness can be improved, but uneven light distribution causes incomplete sintering at edges resulting in burr-like side faces and invalid package areas
Solution Approach 1:
The patent introduces a groove structure that adds a vertical dimension to the light path. The groove allows laser light to enter from the side and reflect off the groove's inner surfaces, creating a multi-directional illumination pattern that uniformly sinters the sealing material at the package area edges, eliminating burr formation while maintaining airtightness.
Solution Approach 2:
The groove acts as an intermediary optical element that redirects and distributes laser light. By introducing this intermediate structure, the patent transforms direct laser irradiation into reflected, evenly distributed light that uniformly heats the sealing material, solving the sintering uniformity problem while preserving the airtightness benefit.
2Reliability
If sealing material is applied at package area edges to ensure airtightness, then packaging reliability improves, but incomplete sintering causes corrosion and reduces component lifespan
Solution Approach 1:
The groove structure enables side-incident laser illumination that completely sinters the sealing material at package edges. This thorough sintering prevents moisture and oxygen penetration, thereby preventing corrosion of sensitive components and extending their operational lifespan while maintaining the necessary airtight seal.
Solution Approach 2:
The groove serves as an optical intermediary that ensures complete and uniform sintering of the sealing material. By redistributing the laser energy through reflection, it eliminates incomplete sintering zones that would otherwise lead to seal failures and component corrosion, thus protecting component lifespan.
3Ease of manufacture
If conventional packaging assembly is used to assemble base substrate and cover plate, then device assembly can be completed, but poor airtightness allows moisture and oxygen entry causing corrosion
Solution Approach 1:
The groove structure is formed in the interlayer insulating layer before the sealing material is applied and before final packaging assembly. This preliminary preparation ensures that when the sealing material is later sintered with laser irradiation, the light is properly distributed to achieve complete and uniform sintering, guaranteeing airtightness from the outset rather than requiring post-assembly corrections.
Solution Approach 2:
The groove acts as a pre-built optical intermediary that guides and reflects laser light during the sealing process. By incorporating this light-redistributing structure into the packaging assembly process, the patent ensures that the sealing material is uniformly sintered, creating an airtight seal that prevents moisture and oxygen ingress while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the packaging airtightness and reliability by ensuring thorough sintering of the sealing material, reducing the occurrence of invalid package areas and extending the lifespan of display device components.
Implementation Method 1
an angle between a side wall of the groove and a bottom surface of the groove is an obtuse angle
Implementation Method 2
ensuring even sintering by reflecting light from the groove's side walls onto the sealing material
Implementation Method 3
ensuring thorough sintering of the sealing material
Data Source
AI summary
A display substrate, a manufacturing method thereof, and a display device are provided, which pertain to the field of display technologies. The display substrate includes a display area and a package area surrounding the display area. The display substrate includes a base substrate and an interlayer insulating layer on the substrate. The interlayer insulating layer has a groove, an orthographic projection of the groove on the base substrate is located within an orthographic projection of the package area on the base substrate, and the groove is provided with a sealing material.


