Display Substrate Grooves for Encapsulation Printing
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Solution Overview
Problem
The development of flexible stretchable displays faces challenges in efficient manufacturing, particularly in the printing of organic encapsulation layers across island regions, which requires long printing times and multiple separate applications.
Innovation Solution
The display substrate design includes recessed grooves in the insulation layers of the bridge regions, allowing the first inorganic encapsulation layer to form corresponding concave grooves that enable the organic encapsulation material to flow between adjacent island regions during printing, reducing the number of printing steps and time required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate printing applications are used to cover organic encapsulation layers across island regions, then complete encapsulation coverage is achieved, but printing time and process complexity increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-forming through-holes in the first inorganic encapsulation layer at positions corresponding to bridge regions before the printing process. This preliminary structural preparation enables the printing liquid to flow continuously across multiple island regions through the pre-established pathways, eliminating the need for multiple separate printing applications and significantly reducing printing time while maintaining complete encapsulation coverage.
Solution Approach 2:
The through-holes in the first inorganic encapsulation layer serve as intermediaries that facilitate the flow of printing liquid between adjacent island regions. These through-holes act as conduits that connect the printing liquid from one island region to another, enabling a single printing application to cover multiple regions that would otherwise require multiple separate applications, thus reducing printing time without compromising encapsulation reliability.
2Reliability
If multiple separate printing applications are used to cover organic encapsulation layers across island regions, then complete encapsulation coverage is achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-forming through-holes in the first inorganic encapsulation layer at positions corresponding to bridge regions before the printing process. This preliminary structural preparation enables the printing liquid to flow continuously across multiple island regions through the pre-established pathways, eliminating the need for multiple separate printing applications and significantly reducing printing time while maintaining complete encapsulation coverage.
Solution Approach 2:
The through-holes in the first inorganic encapsulation layer serve as intermediaries that facilitate the flow of printing liquid between adjacent island regions. These through-holes act as conduits that connect the printing liquid from one island region to another, enabling a single printing application to cover multiple regions that would otherwise require multiple separate applications, thus reducing printing time without compromising encapsulation reliability.
3Stability of the object's composition
If the first inorganic encapsulation layer is continuous across bridge regions, then structural integrity is maintained, but the organic encapsulation material cannot flow between adjacent island regions
Solution Approach 1:
The patent applies segmentation by creating discrete through-holes in the first inorganic encapsulation layer at specific positions corresponding to bridge regions, rather than making the entire layer discontinuous. This selective segmentation maintains the structural integrity and continuity of the encapsulation layer in most areas while creating localized openings that enable printing liquid to flow between adjacent island regions, thus achieving both structural stability and printing efficiency.
Solution Approach 2:
The patent applies local quality by forming through-holes only in specific locations (bridge regions) of the first inorganic encapsulation layer where printing liquid flow is needed, while maintaining the continuous and intact structure of the encapsulation layer in other areas. This localized modification enables the printing liquid to flow between adjacent island regions through the through-holes in bridge regions without compromising the overall structural integrity and continuity of the encapsulation layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient coverage of multiple island regions with the organic encapsulation layer, reducing the time and complexity of the printing process while maintaining effective encapsulation and display performance.
Implementation Method 1
the first inorganic encapsulation layer has corresponding concave second grooves at positions corresponding to the at least one first groove, and the second grooves enable two adjacent island regions to communicate, and are configured to make a printing liquid flow to the adjacent island regions
Data Source
AI summary
Provided are a display substrate, a display device, and a method for manufacturing the display substrate. The display substrate includes: a first inorganic encapsulation layer covering pixels of an island region and covering a signal line of a bridge region, a first organic encapsulation layer covering the first inorganic encapsulation layer, and multiple insulating layers located in the bridge region and between the first inorganic encapsulation layer and a substrate.