Stacked Display Substrate Heat Dissipation via Intermediary Foam
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Solution Overview
Problem
Current liquid crystal display (LCD) technologies face challenges in enhancing image quality and heat dissipation, particularly in maintaining high contrast and preventing frame damage during transportation, due to inadequate heat management in multi-layer display panels.
Innovation Solution
A display device design featuring a stacked configuration with heat dissipation components, such as thermally conductive foam or silicone grease, filling the space between extension portions of array substrates, and strategically positioned control ICs and flexible printed circuits, along with optical clear adhesives and polaroids, to enhance heat dissipation and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a double-layer display panel configuration is used to improve control capacity for luminous flux and contrast, then image quality is improved, but heat dissipation becomes inadequate leading to frame damage during transportation
Solution Approach 1:
A heat dissipation component is introduced as an intermediary element between the first and second array substrates. This component serves as a thermal conduit to transfer heat away from the control ICs and flexible printed circuits, preventing heat accumulation that would otherwise cause frame damage during transportation while maintaining the double-layer display structure for high contrast performance
Solution Approach 2:
The heat dissipation component is strategically positioned at specific locations where heat generation is most critical - between the first extension portion and second extension portion, and between the first control IC and second control IC. This localized heat dissipation approach targets the hottest spots without compromising the overall display quality and contrast enhancement provided by the double-layer configuration
2Ease of manufacture
If control ICs and flexible printed circuits are positioned on extension portions to enable assembly, then manufacturing ease is improved, but heat accumulation increases causing reliability issues
Solution Approach 1:
The heat dissipation component acts as a thermal intermediary between the heat-generating control ICs and flexible printed circuits on the extension portions. It provides a dedicated thermal pathway that separates the heat management function from the electrical connection function, allowing easy assembly while preventing heat accumulation that would compromise reliability
3Device complexity
If space between extension portions is left empty to simplify manufacturing, then manufacturing complexity is reduced, but heat dissipation capacity is insufficient
Solution Approach 1:
The heat dissipation component serves multiple functions simultaneously: it acts as a thermal conduit for heat dissipation, provides mechanical support and spacing between the array substrates, and enhances the overall structural integrity. This multi-functionality justifies the added manufacturing step while delivering significant thermal management benefits
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively addresses heat dissipation issues and improves the reliability of the display device by preventing frame damage and enhancing shock resistance, while maintaining high image quality and contrast.
Implementation Method 1
a space between the first extension portion and the second extension portion is filled with a heat dissipation component at least in an area where the first control IC is located
Data Source
AI summary
A display device and a manufacturing method thereof are provided. The display device includes: a first array substrate, a first opposite substrate, a second array substrate and a second opposite substrate stacked in sequence; the first array substrate comprises a first overlap portion overlapping with the first opposite substrate, a first extension portion extending from the first overlap portion, and the second array substrate comprises a second overlap portion overlapping with the second opposite substrate, a second extension portion extending from the second overlap portion; a side, facing the second extension portion, of the first extension portion comprises a first control IC, and a side, away from the first extension portion, of the second extension portion comprises a second control IC; and a space between the first and the second extension portions is filled with a heat dissipation component at least in an area where the first control IC is.