Display Device Substrate Hole Interconnection for Narrow Frame
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Solution Overview
Problem
Existing display and sensor devices face challenges in reducing the width of their frames while maintaining effective electrical connections between substrates, which affects their performance and reliability.
Innovation Solution
A display and sensor device structure featuring a first substrate with a conductive layer, a second substrate with a hole penetrating through and a projection on its inner surface, and a connecting material that covers the projection to electrically connect the conductive layers, allowing for a thinner frame without the need for additional circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the frame width is reduced to improve display area ratio, then the electrical connection reliability between substrates deteriorates
Solution Approach 1:
The patent transitions from planar wiring connections to three-dimensional vertical connections through substrate holes. The connecting material fills these holes to create electrical connections in the thickness dimension, enabling signal transmission without requiring additional frame space, thus maintaining connection reliability while reducing frame width.
Solution Approach 2:
The patent introduces a connecting material as an intermediary substance that fills the substrate holes and establishes electrical connections between conductive layers on different substrates. This intermediary enables reliable electrical connectivity through the reduced frame structure without direct contact between substrates.
2Area of stationary object
If the frame width is reduced to improve display area ratio, then the structural integrity deteriorates
Solution Approach 1:
The patent reinforces the reduced frame structure by utilizing the thickness dimension. Substrate holes filled with connecting material create vertical support structures that maintain mechanical strength despite the reduced lateral frame width, preventing structural collapse while maximizing display area.
3Reliability
If additional circuit boards are added to maintain electrical connections, then the device complexity increases
Solution Approach 1:
The patent merges the electrical connection function directly into the substrate structure itself. By forming holes in the substrates and filling them with connecting material, the substrates themselves become the connection pathway, eliminating the need for separate circuit boards and simplifying the overall device architecture while maintaining connection reliability.
Data Source
AI summary
According to one embodiment, a display device includes a first substrate, a second substrate, a display function layer, and a connecting material. The first substrate includes a first basement and a first conductive layer. The second substrate includes a second basement including a first hole, a first projection formed on an inner circumferential surface of the first hole, and a second conductive layer. The connecting material covers a surface of the first hole including the first projection and electrically connects the first conductive layer and the second conductive layer.