Display Substrate Hole Layout for Sensor Integration and Screen Ratio
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Solution Overview
Problem
Existing display technologies that incorporate optical sensors, such as cameras, through hole-in-display designs sacrifice display area and hinder the achievement of a high screen-to-body ratio due to the need for encapsulation structures around through holes, while blind hole designs compromise sensor performance for lower transmittance.
Innovation Solution
A display substrate design that integrates both through and blind holes, allowing high-transmittance sensors like cameras in through holes and lower-transmittance sensors like infrared sensors in blind holes, without requiring encapsulation structures, thereby optimizing the screen-to-body ratio and maintaining sensor effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If hole-in-display technology is used to integrate optical sensors, then sensor integration is achieved, but display area is sacrificed
Solution Approach 1:
The patent divides the hole structure into two distinct types: through holes for high-transmittance sensors (cameras) and blind holes for low-transmittance sensors (infrared sensors). This segmentation allows different sensor types to be accommodated with appropriate transmittance characteristics, optimizing both sensor integration and display area utilization without requiring a single compromised hole design for all sensors.
2Reliability
If through holes are used for high-transmittance sensors, then sensor performance is improved, but encapsulation structures are required increasing device complexity
Solution Approach 1:
The patent extracts the encapsulation requirement only where absolutely necessary (around through holes for cameras), while eliminating it for blind holes used by infrared sensors. This selective approach maintains high sensor performance for cameras through protected through holes, while simplifying the overall device structure by removing unnecessary encapsulation structures for other sensor types.
3Device complexity
If blind holes are used for sensors, then device complexity is reduced, but transmittance and sensor performance are compromised
Solution Approach 1:
The patent applies different hole structures (through holes vs. blind holes) to different local regions depending on the specific sensor requirements. High-transmittance cameras receive through holes with selective encapsulation, while low-transmittance infrared sensors receive blind holes without encapsulation. This local quality differentiation ensures each sensor operates at optimal transmittance levels without unnecessary structural complexity.
4Adaptability or versatility
If display area is reduced to accommodate sensors, then sensor integration is achieved, but screen-to-body ratio is hindered
Solution Approach 1:
The patent merges multiple sensor types (cameras and infrared sensors) into a unified hole border area structure that shares common wiring areas and surrounding infrastructure. This consolidation allows diverse sensors to be integrated without proportionally increasing the total area consumed, thereby maintaining higher screen-to-body ratios while achieving comprehensive sensor integration capabilities.
Data Source
AI summary
A display substrate has at least two wiring areas, a hole border area surrounding the wiring areas, a display area surrounding the hole border area, at least one through hole area, at least one blind hole area. The blind hole area is light-transmitting. Each through hole area and each blind hole area are both surrounded by a respective wiring area. The display substrate includes a base substrate having a through hole in each through hole area, and a driver circuit layer which includes at least one metal layer located in the display area and the wiring areas, and at least one insulating layer located in the display area, the hold border area, the wiring areas, and the at least one blind hole area. The metal layer includes a plurality of signal lines arranged to avoid the at least one through hole area and the at least one blind hole area.