Display Substrate Interlayer Insulating Layer Fold Prevention

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Solution Overview

Problem

Existing display substrates face issues with electro-static discharge (ESD) and data gate short (DGS) phenomena due to folds in the interlayer insulating layer, which lead to short circuits between conductive layers, affecting signal transmission.

Innovation Solution

A method of manufacturing a display substrate involving a base substrate with a base insulating layer and a first conductive layer having break faces, where an interlayer insulating layer with stacked sub-layers, including flowable and inorganic materials, is formed to cover the unevenness portions, preventing folds and ensuring flat surfaces, thereby reducing the occurrence of ESD and DGS.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional interlayer insulating layer is formed over uneven surfaces, then the manufacturing process is simple, but folds occur leading to ESD and DGS phenomena

Engineering Contradiction:
Improveelectrical signal transmission stabilityVSAvoidsurface flatness
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The interlayer insulating layer is divided into multiple sub-layers (first insulating sub-layer, second insulating sub-layer, and third insulating sub-layer). Each sub-layer is formed with specific materials and thicknesses to progressively fill and flatten the uneven surface, preventing folds while maintaining manufacturing feasibility

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses composite material structure combining organic insulating material (in the second insulating sub-layer) and inorganic insulating material (in the first and third insulating sub-layers). This composite approach allows the organic layer to fill uneven surfaces effectively while the inorganic layers provide structural stability and flatness

Inventive Principle:
Principle #40Composite materials

2Reliability

If the interlayer insulating layer is made thick to prevent folds, then ESD and DGS are reduced, but the device structure becomes more complex

Engineering Contradiction:
Improveprotection against ESD and DGSVSAvoidnumber of insulating sub-layers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Different regions of the interlayer insulating structure have different material compositions and thicknesses tailored to local requirements. The second insulating sub-layer with organic material is specifically positioned to fill uneven surfaces, while inorganic sub-layers provide overall structural support, creating local quality variations that solve the fold problem without uniformly increasing complexity

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents the formation of folds in the interlayer insulating layer, preventing tips in subsequent conductive layers and reducing the likelihood of ESD and DGS, ensuring stable electrical signal transmission.

Implementation Method 1

forming one of the first insulating sub-layer and the second insulating sub-layer by curing a flowable insulating material

Methodology Applied
Scientific EffectCuring: Phase Change

Implementation Method 2

the curing treatment includes a thermal curing treatment. A temperature of the thermal curing treatment ranges from 200° C. to 250° C., and time of the thermal curing treatment ranges from 10 minutes to 30 minutes

Methodology Applied
Scientific EffectThermal curing: Heat Treatment

Data Source

PatentUS11616113B2Display substrate, preparation method therefor, and display device
Publication Date: 2023.03.28 BOE TECHNOLOGY GROUP CO LTD
  • US11616113B2 patent drawing
  • US11616113B2 patent drawing
  • US11616113B2 patent drawing

AI summary

A method of manufacturing a display substrate includes: providing a base substrate; and forming a base insulating layer, a first conductive layer and an interlayer insulating layer that are sequentially stacked on top of one another at a side of the base substrate. The first conductive layer includes at least one break face, the base insulating layer includes a portion extending outward with respect to each of the at least one break face, and the break face and the corresponding portion extending outward constitute an unevenness portion having a stepped shape. The interlayer insulating layer covers at least the unevenness portion(s). Forming the interlayer insulating layer, includes: forming a first insulating sub-layer and a second insulating sub-layer that are sequentially stacked on top of one another; and forming one of the first insulating sub-layer and the second insulating sub-layer by curing a flowable insulating material.