Display Substrate Data Routing via Lap Vias for Narrow Bezel
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Solution Overview
Problem
Existing display substrates face challenges in efficiently routing data signal lines due to the need for fan-shaped oblique lines in the bonding area, which increases the width of the fan-out region and makes it difficult to narrow the lower bezel.
Innovation Solution
The display substrate incorporates a data connection line structure where the first connection line is connected to the second connection line through a first lap via in the first bezel region, and the data signal line is connected to the second connection line through a second lap via in the display area, reducing the need for fan-shaped oblique lines and minimizing the width of the fan-out region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If fan-shaped oblique lines are used to route data signal lines in the bonding area, then the data signal transmission is achieved, but the width of the fan-out region increases making it difficult to narrow the lower bezel
Solution Approach 1:
The data connection line is segmented into multiple parts: a first connection line extending from the bonding area to the display area, and a second connection line extending from the display area to the data signal line. This segmentation allows the data signal to be routed through different regions (bonding area, display area, side bezel region) rather than using fan-shaped oblique lines in the bonding area, thereby reducing the fan-out region width and enabling narrower lower bezel design.
Solution Approach 2:
The patent utilizes the display area and side bezel region as additional routing dimensions for data signal lines. Instead of confining all routing to the bonding area (2D constraint), the data connection line extends through the display area and side bezel region, effectively using the third dimension (depth/layering) and additional spatial dimensions to achieve signal transmission while minimizing the fan-out region width.
2Area of stationary object
If the data connection line is routed through the display area and side bezel region, then the fan-out region width is reduced, but the routing path length increases
Solution Approach 1:
The patent applies local quality by positioning the first connection line and second connection line in specific regions with appropriate characteristics. The first connection line is routed through the bonding area and display area where space is available, while the second connection line extends through the side bezel region. This localized routing strategy optimizes the balance between path length and fan-out region width by utilizing regions with different spatial characteristics.
3Length of moving object
If the first lap via is provided in the first bezel region, then the data connection is achieved with reduced fan-out width, but the manufacturing complexity increases
Solution Approach 1:
The first lap via acts as an intermediary element that connects the first connection line to the second connection line in the first bezel region. This intermediary structure enables the data signal to transition between different routing segments while maintaining a compact fan-out region width. The lap via provides a standardized connection interface that simplifies the overall manufacturing process despite the multi-segment routing path.
Data Source
AI summary
A display substrate and a preparation method thereof, and a display device. The display substrate comprises a display area (100), a bonding area (200), and a side bezel region (310) at least including a first bezel region (310-1) and a second bezel region (310-2), the first bezel region (310-1) is located on a side of the second bezel region (310-2) close to the bonding area (200); the display substrate comprises a base substrate (101) and a drive circuit layer (102), the base substrate (101) at least comprises a first connection line (70), the drive circuit layer (102) at least comprises a data signal line (60), a second connection line (80) connected to the first connection line through a first lap via (DV1), the data signal line is connected to the second connection line through a second lap via (DV2), the first lap via is provided in the first bezel region.