Display Substrate Motherboard Laser Cutting with Inorganic Film Layer
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Solution Overview
Problem
The existing methods for cutting display substrate motherboards result in unsatisfactory outcomes and low yield of display substrates due to damage from carbonization particles during the laser cutting process.
Innovation Solution
A manufacturing method involving an inorganic film layer with a specific thickness range of 200 to 400 nm in the cutting region, which is formed and then etched to prevent carbonization and ensure the integrity of the display substrate, along with a bezel region structure that maintains the necessary film layers to support the display units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser cutting is performed on the display substrate motherboard, then the display substrate can be separated from the motherboard, but carbonization particles are generated that damage the substrate and reduce yield
Solution Approach 1:
An inorganic film layer is introduced as an intermediary between the organic substrate and the laser cutting process. This film layer absorbs the harmful effects of laser irradiation, preventing carbonization of the organic substrate while enabling clean cutting separation of the display substrate from the motherboard.
Solution Approach 2:
The inorganic film layer is formed on the organic substrate before the laser cutting process. This preliminary protective action ensures that when laser cutting occurs, the organic substrate is already protected from carbonization, allowing high-efficiency cutting without damaging the substrate integrity.
2Reliability
If the inorganic film layer thickness is increased to prevent carbonization, then substrate protection improves, but cutting quality deteriorates due to excessive thickness
Solution Approach 1:
The thickness of the inorganic film layer is precisely controlled within the range of 200-400 nm. This parameter optimization ensures the film is thick enough to prevent carbonization during laser cutting, yet thin enough to maintain good cutting quality and avoid excessive material removal or cutting defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield of display substrates by preventing carbonization and reducing the likelihood of cracks during laser cutting, thereby improving the overall cutting process efficiency.
Implementation Method 1
the effect of cutting the display substrate motherboard is not satisfactory, and the yield of the display substrate after cutting is not high
Data Source
AI summary
The present disclosure provides a display substrate motherboard and a manufacturing method thereof, and a display device, wherein the display substrate motherboard includes a plurality of display units located on an organic substrate and a cutting region between adjacent display units, and the cutting region includes therein the organic substrate and an inorganic film layer covering the organic substrate.