Display Substrate Encapsulation Layout for OLED Moisture Blocking

The encapsulation structure is divided into multiple segments: organic encapsulation layers (first and second organic encapsulation layers) and inorganic encapsulation layers (first and second inorganic encapsulation layers) arranged in alternating sequence. This segmented multi-layer structure prevents crack propagation through the entire encapsulation path, as cracks in one layer are blocked by the next layer, thereby solving the GDS defect problem while maintaining moisture resistance.

The patent employs a composite encapsulation structure combining organic and inorganic materials. The organic encapsulation layers provide flexibility and stress relief, while the inorganic encapsulation layers provide barrier properties against moisture. This composite approach creates a synergistic effect where each material type compensates for the weaknesses of the other, preventing cracks while maintaining effective moisture blocking.

Instead of using a single thick encapsulation layer, the patent segments the encapsulation into multiple thinner alternating organic and inorganic layers. This segmentation distributes the mechanical stress across multiple interfaces, preventing stress concentration that would lead to cracking, while the cumulative thickness maintains effective moisture blocking capability.

The organic encapsulation layers act as flexible components that can accommodate thermal expansion and mechanical stress, preventing crack formation. These thin organic film layers provide stress relief while the inorganic layers provide the moisture barrier, creating a flexible yet protective encapsulation system that resists both moisture and cracking.