Display Substrate Overcoat Teeth Slits Short Circuit Prevention
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Solution Overview
Problem
Conventional display apparatuses with integrated driver circuits and printed circuit boards suffer from increased thickness, and the chip-on-glass mounting method faces issues with short circuits due to accumulated conductive beads at the interface between bonding areas.
Innovation Solution
A display substrate design featuring a base substrate with an overcoat layer having teeth and slits, and conductive lines extending from a second area to a first area for bonding a driver integrated circuit, where the conductive lines are electrically connected to signal lines and the overcoat layer's teeth are wider than the conductive lines, preventing short circuits by directing excess conductive beads into slits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If chip-on-glass mounting method is used to reduce thickness, then display apparatus thickness is reduced, but short circuit risk increases due to accumulated conductive beads at the interface
Solution Approach 1:
The overcoat layer is segmented into multiple teeth protruding toward the first area, creating multiple isolated bonding regions. This segmentation prevents conductive beads from accumulating continuously across the interface by breaking the conductive path into discrete sections, each bounded by teeth and slits.
Solution Approach 2:
The overcoat layer has different structural characteristics in different regions: teeth protrude in areas adjacent to the first area while slits are positioned between teeth. This local variation in structure creates zones that guide conductive beads into slits rather than allowing random accumulation, thereby reducing short circuit risk while maintaining thin profile.
2Reliability
If conventional mounting with printed circuit board is used, then electrical connections are reliable, but display apparatus thickness increases significantly
Solution Approach 1:
The patent merges the driver integrated circuit directly onto the display substrate in the first area, eliminating the need for a separate printed circuit board. The conductive lines extend from the second area through the overcoat layer to connect with the driver integrated circuit, integrating multiple functions into a single thin structure.
Solution Approach 2:
The overcoat layer with its specific tooth-and-slit structure serves as an intermediary between the driver integrated circuit and the conductive lines. It provides both mechanical support and electrical isolation, guiding conductive beads into designated slits while maintaining reliable electrical connections through the conductive line paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a thinner display apparatus with reduced risk of short circuits, ensuring reliable electrical connections and maintaining the structural integrity of the display panel.
Implementation Method 1
the driver integrated circuit in a chip-on-glass type display apparatus is mounted to the display substrate using an anisotropic conductive film
Data Source
AI summary
The present application discloses a display substrate having a first area for bonding a driver integrated circuit. The display substrate includes a base substrate; an overcoat layer on the base substrate in a second area of the display substrate; the overcoat layer having an interface portion in an area abutting the first area, the interface portion having a plurality of teeth and a plurality of slits, two adjacent teeth being spaced apart by a slit; and a conductive line layer on a side of the overcoat layer proximal to the base substrate, having a plurality of conductive lines extending from the second area to the first area; each of the plurality of conductive lines electrically connected to a signal line in the second area.