Display Substrate Partial Via Filling for Thermal Stress Mitigation
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Solution Overview
Problem
Existing display technologies face challenges in efficiently connecting signal wiring with pixel drive circuits in a three-dimensional integration structure, leading to issues with thermal stress and sidewall burrs.
Innovation Solution
A display substrate with a base substrate featuring a connection via hole, where a connection structure is formed to partially fill the via hole, electrically connecting the signal wiring with the pixel drive circuit. The connection structure includes a first substructure on the sidewall and a second substructure connected to it, formed through electroplating and patterning processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connection via hole is completely filled by the connection structure, then the electrical connection between signal wiring and pixel drive circuit is improved, but thermal stress and sidewall burrs increase
Solution Approach 1:
The connection via hole is partially filled by the connection structure rather than being completely filled. This partial filling approach provides sufficient electrical connection between the signal wiring and pixel drive circuit while leaving space to mitigate thermal stress accumulation and prevent sidewall burrs, thus resolving the contradiction between connection reliability and harmful factor reduction
2Volume of moving object
If 2.5D integration technology is adopted to extend integration space to third dimension, then space utilization and integration level are improved, but the complexity of connecting signal wiring with pixel drive circuit increases
Solution Approach 1:
The connection structure is divided into multiple segments including a bottom portion, middle portion, and top portion with different cross-sectional areas. This segmentation allows each segment to serve specific functions: the bottom portion provides mechanical support and stress relief, the middle portion establishes electrical connection, and the top portion connects to signal wiring, thereby simplifying the overall connection process in 2.5D integration
3Productivity
If the connection structure is formed to provide efficient signal transmission, then signal transmission efficiency is improved, but the manufacturing process complexity increases
Solution Approach 1:
The connection structure utilizes parameter changes in its geometry, with the cross-sectional area varying along the thickness direction of the base substrate. The bottom portion has a larger cross-sectional area for stress distribution, while the top portion has a smaller area for precise electrical connection. This parameter variation is achieved through controlled material deposition and removal processes, balancing signal transmission efficiency with manufacturability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The partial filling of the connection via hole by the connection structure mitigates sidewall burrs and thermal stress, improving the yield and reliability of the display substrate while enabling efficient signal transmission.
Implementation Method 1
The connection structure includes a first substructure disposed on a sidewall of the connection via hole and a second substructure connected to the first substructure
Data Source
AI summary
Disclosed are a display substrate. The display substrate of the present disclosure includes a base substrate, a pixel drive circuit, and a connection structure. The base substrate is provided with a connection via hole penetrating in a thickness direction of the base substrate, and the base substrate includes a first surface and a second surface disposed oppositely along the thickness direction of the base substrate; the pixel drive circuit is disposed on the first surface; the signal wiring is disposed on the second surface; and the connection structure is disposed in the connection via hole and electrically connects the signal wiring with the pixel drive circuit. The connection via hole is partially filled by the connection structure.