Peripheral Bond Reinforcement for Display Substrate Detachment
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Solution Overview
Problem
Existing display devices with touch panels face challenges in maintaining strong and elastic bonding between the cover panel and sensor substrate, particularly under varying environmental conditions, which can lead to detachment due to differences in thermal expansivity and mechanical stress.
Innovation Solution
A bonding configuration that includes a stronger and more elastic bond made of silicon, acrylic, or urethane resin, which is cured with UV light or moisture, surrounding the optical elastic resin layer, ensuring secure attachment to the periphery of the cover panel and sensor substrate, and extending beyond the resin layer to reinforce the bonding interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding resin layer is used to bond the cover panel and sensor substrate, then the bonding provides basic adhesion, but the bonding strength and elasticity are insufficient under thermal changes and mechanical stress
Solution Approach 1:
The patent uses a composite bonding structure combining two different materials: a bonding resin layer (OCR or OCA) for basic adhesion and a bond made of cured adhesive (silicon, acrylic, or urethane resin) for enhanced strength and elasticity. This composite approach allows each material to contribute its superior properties, resolving the contradiction between basic bonding and enhanced detachment resistance.
Solution Approach 2:
The patent applies different bonding materials to different regions: the bonding resin layer is used in the central bonding area, while the more elastic and stronger cured adhesive bond is applied to the peripheral regions (first region, second region, third region, and fourth region). This local differentiation ensures that the peripheral areas, which experience higher stress during detachment, receive enhanced bonding strength and elasticity.
2Area of stationary object
If the bonding resin layer extends to the outer end faces of substrates, then maximum bonding area is achieved, but the bonding interface becomes vulnerable to detachment under stress
Solution Approach 1:
The patent creates a local quality differentiation where the bond made of cured adhesive is applied specifically to peripheral regions (first region, second region, third region, and fourth region) rather than uniformly across the entire bonding area. This ensures that the most critical peripheral interfaces, which are most vulnerable to detachment, receive enhanced bonding strength while maintaining adequate bonding area in the central region.
Solution Approach 2:
The bonding structure is segmented into two distinct components: the bonding resin layer that provides baseline adhesion across the bonding area, and the peripheral bond made of cured adhesive that reinforces critical interfaces. This segmentation allows each component to perform its specialized function optimally.
3Stability of the object's composition
If a rigid bonding structure is used, then structural stability is achieved, but the bonding cannot accommodate thermal expansion differences between materials
Solution Approach 1:
The patent combines materials with different mechanical properties: the bonding resin layer provides structural stability, while the bond made of cured adhesive (silicon, acrylic, or urethane resin) provides elasticity to accommodate thermal expansion differences. This composite material approach resolves the contradiction between rigidity and flexibility.
Solution Approach 2:
The patent changes the elastic modulus parameter by introducing a more elastic material (cured adhesive) in the peripheral regions. This allows the bonding structure to dynamically adjust its mechanical properties, maintaining structural stability while adapting to thermal expansion variations through the elastic deformation capability of the cured adhesive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances the detachment resistance of the optical elastic resin layer, preventing detachment even under significant thermal changes and mechanical stress, while maintaining transparency and optical clarity.
Implementation Method 1
a bond made of cured adhesive... The bond has a stronger bonding force and a higher elasticity than the bonding resin layer
Implementation Method 2
The refractive index of the sensor glass is approximate to the refractive index of the optical elastic resin layer
Data Source
AI summary
A panel module includes a bonding resin layer between a first main face of a first substrate and a second main face of second substrate, and a bond made of cured adhesive. At least a part of an outer end face of the bonding resin layer is located inner than an outer end face of the first substrate and an outer end face of the second substrate. The bond has a stronger bonding force and a higher elasticity than the bonding resin layer. The bond is attached to a first region of the first main face and a second region of the second main face in an area outer than the bonding resin layer. The bond is attached to a third region of the outer end face of the second substrate and a fourth region of the first main face.