Display Substrate Pin Layout for Aging Space in Bonding Areas
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Solution Overview
Problem
The increasing number of circuit boards and bonding pins in display products with improved resolution and Flexible Multi-Layer On cell structure has resulted in insufficient space for arranging aging pins in the bonding area, necessitating a more efficient pin arrangement to facilitate effective testing and bonding.
Innovation Solution
The display substrate design includes alternating aging pin groups between bonding pin groups, with specific configurations for transmitting gate drive control and direct current signals, ensuring adequate space and connectivity for aging pins, and optimizing signal consistency through side-by-side arrangement of aging and bonding pin groups.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the number of circuit boards and bonding pins is increased to improve display resolution and structure, then the display quality and functionality are improved, but the space for arranging aging pins in the bonding area becomes insufficient
Solution Approach 1:
The bonding area is segmented into multiple bonding pin groups arranged along the first direction, with aging pin groups positioned between adjacent bonding pin groups. This segmentation allows the limited bonding area to accommodate both bonding pins and aging pins by dividing the space into functional zones, thereby resolving the space insufficiency problem while maintaining high display resolution requirements.
2Ease of operation
If aging pins are arranged in the bonding area to enable testing, then the testing capability is improved, but the bonding pin arrangement and space utilization become more complex
Solution Approach 1:
Aging pin groups are locally positioned in specific regions between bonding pin groups along the first direction, rather than uniformly distributing all pins throughout the bonding area. This localized arrangement provides testing capability where needed while maintaining a simple and systematic overall pin arrangement structure, avoiding excessive complexity in the bonding area design.
3Reliability
If multiple aging pin groups are arranged between bonding pin groups, then the signal transmission for aging and testing is improved, but the bonding pin group arrangement becomes more complex
Solution Approach 1:
Multiple aging pin groups are arranged along the first direction (horizontal dimension) between bonding pin groups, utilizing the spatial dimension to accommodate multiple aging pin groups without increasing vertical complexity. This dimensional arrangement ensures adequate signal transmission paths for aging and testing while maintaining a systematic and manageable pin group structure through ordered positioning.
Data Source
AI summary
A display substrate, including: a base substrate, multiple sub-pixels, multiple data lines, multiple test circuit groups, multiple aging pin groups and multiple binding pin groups. The base substrate includes a display area and a binding area. The multiple sub-pixels are in the display area. The multiple data lines are electrically connected to the multiple sub-pixels. The multiple test circuit groups are arranged along a first direction and electrically connected to the multiple data lines. The multiple aging pin groups and the multiple binding pin groups are in the binding area and on a side of the multiple test circuit groups facing away from the display area. The multiple binding pin groups are arranged along the first direction, and at least one aging pin group is arranged between every two adjacent binding pin groups. Each binding pin group is configured to be bonded and connected to at least one circuit board.