Display Substrate Organic Layer Plasma Treatment
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Solution Overview
Problem
Conventional display panels face issues with parasitic capacitance between electrodes, leading to increased power consumption and reduced moisture resistance due to organic residues on the surface of the organic layer, which affect bonding between layers and the frame sealant.
Innovation Solution
A method involving a surface treatment process using plasma to remove organic residues from the organic layer, followed by the formation of a passivation layer, which reduces parasitic capacitance and enhances bonding between layers and the frame sealant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional organic layer is formed without surface treatment, then the fabrication process is simple, but organic residues remain on the surface causing increased parasitic capacitance and poor bonding
Solution Approach 1:
The patent applies a surface treatment process (plasma treatment, UV irradiation, or chemical treatment) to the organic layer before forming the passivation layer. This preliminary action removes organic residues and activates the surface, improving subsequent bonding without requiring fundamental changes to the fabrication process flow
Solution Approach 2:
The patent changes the surface properties of the organic layer by treating it with plasma, UV light, or chemical agents. This alters the surface energy and chemistry of the organic layer, enabling better adhesion to the passivation layer and frame sealant while reducing parasitic capacitance
2Use of energy by moving object
If the organic layer surface is not treated, then the fabrication process is faster, but parasitic capacitance between electrodes increases power consumption
Solution Approach 1:
The surface treatment is performed as a preliminary step before passivation layer formation. By treating the organic layer surface in advance, the process reduces parasitic capacitance that would otherwise increase power consumption during display operation, while the treatment itself is a rapid process that minimizes impact on throughput
3Reliability
If organic residues are present on the organic layer surface, then no additional processing is needed, but moisture resistance and bonding between layers deteriorate
Solution Approach 1:
The patent applies surface treatment methods (plasma, UV, or chemical) that fundamentally change the surface parameters of the organic layer. This treatment removes organic residues and creates a surface with improved wettability and adhesion properties, enabling the passivation layer and frame sealant to bond effectively while providing moisture resistance
Solution Approach 2:
The patent replaces mechanical cleaning methods with field-based treatments such as plasma treatment or UV irradiation. These field-based methods more effectively remove organic residues and activate the surface without the limitations of mechanical contact, improving both moisture resistance and manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces parasitic capacitance, improves the surface condition of the display substrate, and enhances moisture resistance, allowing the display panel to pass the pressure cooker test.
Implementation Method 1
the surface treatment process includes treating the surface of the organic layer with a plasma; reacting the organic residues with the plasma to form one or more reaction products
Data Source
AI summary
The present application discloses a method of fabricating a display substrate having an organic layer for reducing parasitic capacitance between electrodes in different layers. The method includes forming the organic layer on a base substrate; subjecting the organic layer to a surface treatment process to descum organic residues from a surface of the organic layer; and forming a passivation layer on a side of the organic layer distal to the base substrate subsequent to subjecting the organic layer to the surface treatment process.