Display Substrate Power-Line Layout for Moisture-Resistant Encapsulation
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Solution Overview
Problem
The risk of water and oxygen erosion at the line inlet port in display substrates due to power lines entering the encapsulation region is not adequately addressed by existing technologies, leading to potential defects and reduced encapsulation performance.
Innovation Solution
A display substrate design featuring a base substrate with pixel units, a blocking structure, an auxiliary connection structure, and a cathode layer, where the distance between the first connection position of the power line and the blocking structure is increased to reduce water vapor introduction, and an organic pattern is used to prevent water vapor ingress through hydrophilic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power line enters the encapsulation region from the bonding region close to the pixel units, then the power signal can be effectively delivered to the pixel units, but water and oxygen can be introduced at the line inlet port, compromising encapsulation performance
Solution Approach 1:
The patent introduces an auxiliary connection structure as an intermediary between the power line and the pixel units. This auxiliary connection structure includes a first connection portion connected to the power line and a second connection portion connected to the pixel units, with a connection line connecting these two portions. The auxiliary connection structure is positioned away from the bonding region, serving as a mediator that delivers power signals without creating direct exposure points at the encapsulation boundary where water and oxygen could penetrate.
Solution Approach 2:
The patent relocates the connection from the traditional planar arrangement at the bonding region to a three-dimensional configuration where the auxiliary connection structure is positioned at a different spatial location (away from the bonding region) and connected through a connection line that extends through the encapsulation layer. This dimensional relocation removes the vulnerable line inlet port from the encapsulation boundary while maintaining electrical connectivity.
2Ease of manufacture
If the power line is positioned close to the bonding region for efficient signal transmission, then manufacturing is simplified, but the encapsulation performance deteriorates due to increased risk of water vapor ingress
Solution Approach 1:
The auxiliary connection structure serves as an intermediary that decouples the manufacturing simplicity of direct bonding region connections from the reliability requirements of encapsulation. By introducing this intermediate connection structure positioned away from the bonding region, the patent maintains ease of manufacture through standard connection processes while achieving superior encapsulation performance by eliminating exposed line inlet ports at the encapsulation boundary.
3Device complexity
If the power line enters through the bonding region, then the device complexity is reduced, but the encapsulation region becomes vulnerable to water and oxygen erosion
Solution Approach 1:
The auxiliary connection structure acts as an intermediary element that adds minimal complexity to the power line structure while significantly improving encapsulation integrity. This intermediate connection structure includes a first connection portion, a second connection portion, and a connection line, creating a distributed connection architecture that eliminates direct exposure at the bonding region while maintaining electrical functionality.
Solution Approach 2:
The patent transitions from a simple planar power line configuration at the bonding region to a three-dimensional connection architecture where the auxiliary connection structure and connection line extend through the encapsulation layer to reach pixel units. This dimensional change redistributes the connection points away from the vulnerable bonding region boundary, reducing exposure to water and oxygen while maintaining electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces water vapor introduction into the pixel units, ensuring the yield and display effect of the substrate by minimizing erosion and enhancing encapsulation performance.
Implementation Method 1
an organic pattern, located on the side of the auxiliary connection structure away from the base substrate
Data Source
AI summary
Provided is a display substrate including a base substrate, a plurality of pixel units, at least one first power line, a blocking structure, an auxiliary connection structure, a cathode layer, and a first organic pattern. A distance between a first connection position closer to a first portion of the at least one first power line and the blocking structure is arranged to be larger.