Display Substrate Protruding Barrier for Adhesive Control
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Solution Overview
Problem
Conductive adhesive in vehicle-mounted displays can spread to wiring regions due to fluidity, causing short circuits when the passivation layer ruptures or perforates, leading to poor display performance.
Innovation Solution
A display substrate design featuring a protruding portion between the conductive adhesive coating and wiring regions, which prevents the conductive adhesive from spreading and blocks electrical connection through ruptures or perforations in the passivation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesive is applied to the conductive adhesive coating portion for electrical connection, then electrical coupling between display substrate and encasing substrate is achieved, but the conductive adhesive may spread to the wiring region causing short circuits
Solution Approach 1:
The patent introduces a protruding portion that divides the space between the conductive adhesive coating portion and the wiring region, creating separate zones. This segmentation prevents the conductive adhesive from spreading to the wiring region while maintaining electrical connection functionality in the designated coating area.
Solution Approach 2:
The protruding portion acts as an intermediary barrier structure between the conductive adhesive coating portion and the wiring region. It physically blocks the spread of conductive adhesive to the wiring area, serving as a protective mediator that maintains electrical connection reliability without causing short circuits.
2Manufacturing precision
If the passivation layer is thin or has defects, then manufacturing cost is reduced and manufacturing precision is improved, but short circuits occur when the passivation layer ruptures or perforates
Solution Approach 1:
The protruding portion is formed in advance during the substrate processing stage, before the conductive adhesive is applied. This preliminary structural preparation creates a built-in barrier that proactively prevents adhesive spread to wiring regions, even when the passivation layer has defects or ruptures, thereby preventing short circuits before they can occur.
Solution Approach 2:
The protruding portion serves as a pre-established protective barrier that cushions against the potential harmful effect of conductive adhesive spreading. By having this structural barrier in place before adhesive application, the system is prepared to prevent short circuits even when the passivation layer is compromised.
3Reliability
If a protruding portion is added to prevent conductive adhesive spread, then short circuit prevention is improved, but device complexity increases
Solution Approach 1:
The protruding portion is integrated with the substrate structure itself, combining the protective barrier function with the existing substrate geometry. This merging approach adds the short circuit prevention feature without requiring completely separate additional components, thereby limiting the increase in device complexity.
Solution Approach 2:
The protruding portion serves multiple functions: it acts as a physical barrier to prevent conductive adhesive spread, maintains structural integrity of the substrate, and defines the boundary between functional regions. This multi-functionality reduces the need for additional dedicated components, thereby minimizing the increase in device complexity while achieving reliable short circuit prevention.
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
A display substrate includes a substrate, a first portion, a second portion, and a protruding portion. The first portion, the second portion, and the protruding portion are disposed over an upper surface of the substrate. The first portion is configured to coat a conductive adhesive thereon for attachment, and for electric coupling, of the display substrate with an encasing substrate. The second portion includes at least one wiring. The protruding portion is disposed between the first portion and the second portion, and is configured to prevent the conductive adhesive coated on the first portion from spreading to the second portion. One or more first depressions can be further arranged between the first portion and the protruding portion, configured such that a bottom surface thereof has a shorter distance to the upper surface of the substrate than the upper surface of the first portion.