Display Substrate Protrusions Blocking Moisture Penetration
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Solution Overview
Problem
Current package technologies for electronic display products are inadequate in preventing environmental factors such as water vapor and oxygen from affecting the internal structure, leading to performance degradation and reduced lifespan.
Innovation Solution
A display substrate with protrusions in the non-display region, where the protrusions are integrated between various layers such as the passivation, interlayer insulating, gate insulating, and buffer layers, increasing the paths for water and oxygen to enter and enhancing the adhesion and package effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional package technologies are used, then the manufacturing process is simple, but the package effect is insufficient and cannot prevent water vapor and oxygen from affecting internal components
Solution Approach 1:
The invention divides the non-display region into multiple protrusion structures that extend vertically between layers. These segmented protrusions create multiple tortuous paths for water vapor and oxygen, effectively blocking their penetration routes without requiring a complete redesign of the entire package structure.
Solution Approach 2:
The invention adds a vertical dimension to the package structure by introducing protrusions that extend between different layers (substrate, buffer layer, gate insulating layer, interlayer insulating layer, passivation layer). This vertical segmentation creates tortuous paths that block environmental factors from reaching internal components through the non-display region.
2Object-affected harmful factors
If the non-display region is left flat, then the manufacturing process is simple, but water vapor and oxygen can easily penetrate to internal components
Solution Approach 1:
The protrusion structures are formed during the manufacturing process by extending certain layers (such as the buffer layer, gate insulating layer, or interlayer insulating layer) into the non-display region before final assembly. This preliminary formation of tortuous paths ensures environmental protection is built-in from the start without requiring additional post-manufacturing steps.
Solution Approach 2:
The invention merges the protrusion formation with existing layer deposition processes. The protrusions are created by extending functional layers (buffer layer, gate insulating layer, interlayer insulating layer) during their normal formation process, combining structural protection with functional layers without adding separate manufacturing steps.
3Reliability
If protrusions are added to increase tortuous paths, then package effect is improved, but the adhesion between layers must be enhanced to prevent delamination
Solution Approach 1:
The invention applies different adhesion enhancement strategies to different regions: the protrusion structures in the non-display region provide mechanical interlocking and tortuous paths for environmental factors, while the display region maintains standard layer adhesion. This localized approach optimizes package effect where needed without compromising overall structural integrity.
Solution Approach 2:
The invention uses composite layer structures where different materials with complementary properties are combined. For example, the protrusions may consist of inorganic insulating layers (such as silicon oxide or silicon nitride) that provide both mechanical support and environmental barrier properties, while organic layers provide flexibility and adhesion, creating a composite structure that addresses both package effect and adhesion requirements.
Data Source
AI summary
A display substrate and a manufacture method thereof, and a display panel are provided. The display substrate includes: a substrate, including a display region and a non-display region around the display region; at least one protrusion on the substrate. The protrusion is disposed in the non-display region.