Display Substrate Rear Circuit Relocation for Full Front Surface
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Solution Overview
Problem
Existing display apparatuses have a significant peripheral area outside the display area, which limits their ability to achieve a full display surface, especially when driving circuits and wires are located on the rear surface, restricting the implementation of a full display on the front surface.
Innovation Solution
The display apparatus is designed with a substrate having a display area on the front surface and a non-display area on the rear surface, where the first conductive pattern is buried within the substrate and exposed on the rear surface, allowing the electronic structure to be directly connected, reducing the peripheral area by relocating driving circuits and wires to the rear surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If driving circuits and wires are arranged on the front surface of the substrate, then the display area can be fully utilized, but the peripheral area increases and aesthetic appearance deteriorates
Solution Approach 1:
The patent moves the driving circuits and wires from the front surface (2D plane) to the rear surface of the substrate, utilizing the third dimension (depth/thickness) to resolve the conflict between display area utilization and aesthetic appearance. This allows the front surface to be fully dedicated to display while circuits are positioned on the back surface.
Solution Approach 2:
Instead of placing the driving circuits on the conventional front surface, the patent inverts the arrangement by positioning them on the rear surface of the substrate. This inversion allows the front surface to achieve full display coverage while maintaining aesthetic appearance by hiding the circuits on the back.
2Area of stationary object
If driving circuits are placed on the rear surface of the substrate, then the peripheral area is reduced, but the connection complexity increases
Solution Approach 1:
The patent embeds the first conductive patterns within grooves formed in the substrate, creating a nested structure where conductive elements are integrated into the substrate thickness. This nesting approach reduces the peripheral area while managing connection complexity by organizing conductors in a compact, multi-level arrangement within the substrate volume.
Solution Approach 2:
The patent utilizes the vertical dimension by forming grooves and embedding conductive patterns at different depths within the substrate. This three-dimensional arrangement of conductors allows for reduced peripheral area while systematically organizing connections to manage complexity through spatial separation in the vertical direction.
3Strength
If the substrate surface is made rough for better adhesion, then the bonding strength increases, but the optical quality deteriorates
Solution Approach 1:
The patent applies different surface qualities to different regions of the substrate: the first surface (display surface) maintains high optical quality with smooth finish, while the second surface (rear surface) has increased roughness for enhanced adhesion. This local differentiation allows each surface to optimize its specific function without compromising the other.
Solution Approach 2:
The patent segments the substrate into two distinct surfaces with different properties: the front surface optimized for optical display and the rear surface optimized for adhesion. This segmentation allows independent optimization of each surface's characteristics to fulfill their respective functions.
Data Source
AI summary
A display apparatus includes: a substrate including a first surface, a second surface opposite the first surface, a display area defined on the first surface, and a non-display area defined on the second surface; a plurality of display elements at the display area on the first surface of the substrate; a driving circuit on the second surface and overlapping with the display area of the substrate; a first conductive pattern on the second surface of the substrate; and a second conductive pattern on the first surface of the substrate and connected to the first conductive pattern via a contact hole extending through the substrate. A surface roughness of the second surface of the substrate is greater than a surface roughness of the first surface of the substrate.