Display Substrate Recessed Dielectric Layer for LED Positioning
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Solution Overview
Problem
The manufacturing of full-color light-emitting diode panels is complicated due to the need for additional components like a black matrix or printing retaining wall to limit the red conversion layer, which increases complexity.
Innovation Solution
A display substrate with recessed portions on a dielectric layer, where first-type light-emitting diodes (e.g., blue) and second-type light-emitting diodes (e.g., green) are arranged with a photoluminescence structure to convert light, eliminating the need for a separate retaining wall or black matrix by using the dielectric layer's structure to stagger and position the diodes and photoluminescence material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If additional components like black matrix or printing retaining wall are used to limit the red conversion layer, then the red conversion layer can be properly positioned and limited, but the manufacturing process becomes complicated and device complexity increases
Solution Approach 1:
The patent merges the positioning function into the dielectric layer structure itself by forming recessed portions that directly hold the red conversion layer and light-emitting diodes. This eliminates the need for separate black matrix or printing retaining wall components, thereby reducing device complexity while maintaining positioning precision through the integrated structural design.
Solution Approach 2:
The patent extracts and removes the additional components (black matrix, printing retaining wall) from the manufacturing process. By using the dielectric layer's recessed portions to provide the limiting and positioning function, these extra components become unnecessary, simplifying the manufacturing process while preserving the required positioning accuracy.
2Reliability
If multiple different wafer substrates are used for different colored mini-type LEDs, then each color can be optimized for its specific requirements, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The patent employs a universal sapphire wafer substrate for growing all three colors of mini-type LEDs (red, green, blue). This single substrate type serves multiple functions and enables a unified manufacturing process, thereby improving productivity and manufacturing efficiency while maintaining optimized electroluminescence performance for each color through appropriate material selection and device structure design.
3Adaptability or versatility
If mini-type LEDs are transferred from wafer substrates to array substrate, then active matrix drive can be achieved, but the transfer process adds complexity and difficulty
Solution Approach 1:
The patent merges the transfer destination function into the dielectric layer by integrating the array substrate structure with the dielectric layer containing recessed portions. This unified structure allows mini-type LEDs to be transferred directly into the pre-formed recessed portions, simplifying the transfer process while achieving active matrix drive capability through the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process by eliminating the need for additional components, facilitating easier transfer and positioning of light-emitting diodes and reducing complexity in achieving full-color display.
Implementation Method 1
a photoluminescence structure, the photoluminescence structure being located in at least some of the recessed portions, located on a side, facing away from the base substrate, of the first-type light-emitting diode, and configured to convert light of a first wave length emitted by the first-type light-emitting diode into light of a second wave length
Data Source
AI summary
Provided are a display substrate, a display device, and a manufacturing method for a display substrate. The display substrate includes: a base substrate; a dielectric layer, which is located on one side of the base substrate, the dielectric layer comprising a plurality of recessed portions; a plurality of first-type light-emitting diodes, one of the first-type light-emitting diodes being located in one of the recessed portions; and a photoluminescence structure, the photoluminescence structure being located in at least some of the recessed portions, and being located on the side of the first-type light-emitting diode that faces away from the base substrate.