Display Substrate Step Structure for UDC Circuit Reliability

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Solution Overview

Problem

Display apparatuses with under-display cameras (UDCs) face circuit defects due to the exposure of conductive connection structures, which are prone to corrosion and warping, leading to electrical shorts and potential burning during the aging process.

Innovation Solution

A display substrate design featuring an insulating material structure with a step structure at its edge and a conductive connection structure within, protected by a barrier wall, which prevents corrosion and warping, thereby avoiding electrical connections between electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the drive circuit is provided outside the display area to improve light transmittance, then the light transmittance is improved, but the circuit is prone to defects

Engineering Contradiction:

Improvelight transmittanceVSAvoidcircuit reliability

Core Design Contradiction:

Illumination intensityVSReliability

Solution Approach 1:

The patent divides the display substrate into distinct functional zones: a display area with light-emitting devices and pixel circuits, and a frame area with drive circuits. This segmentation allows the drive circuit to be positioned outside the display area, improving light transmittance while maintaining circuit functionality through dedicated connection structures

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces an insulating material structure with a conductive connection structure as an intermediary between the drive circuit and light-emitting devices. This intermediary protects the conductive connection structure from corrosion by encapsulation layer materials while ensuring reliable electrical connection, thus resolving the reliability issue

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the conductive connection structure is exposed during film layer forming process, then the manufacturing process is simplified, but the conductive connection structure is prone to corrosion and warping

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidconductive connection structure integrity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent performs preliminary protection by providing the insulating material structure covering the conductive connection structure before the encapsulation layer formation process. This preliminary action prevents corrosion and warping of the conductive connection structure during subsequent manufacturing steps, eliminating the need for complex protective measures later

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The insulating material structure serves as an intermediary protective layer between the conductive connection structure and the encapsulation layer. It prevents direct contact between the conductive connection structure and potentially corrosive materials in the encapsulation layer, while still allowing the manufacturing process to proceed efficiently

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If the edge of the insulating material structure is sharp, then the manufacturing precision is improved, but the subsequent film layer is prone to fracture

Engineering Contradiction:

Improveinsulating material structure precisionVSAvoidfilm layer strength

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The patent applies curvature to the edge of the insulating material structure by forming a stepped structure instead of a sharp edge. This curved/stepped configuration reduces stress concentration at the edge, preventing fracture of subsequent film layers deposited on the insulating material structure, while still maintaining manufacturing precision through controlled step formation

Inventive Principle:

Principle #14Spheroidality (Curvature)

Data Source

PatentUS12615954B2Display apparatuses, display substrates, and methods of preparing display substrates

Publication Date: 2026.04.28 CHENGDU BOE OPTOELECTRONICS TECH CO LTD

AI summary

The present disclosure relates to the field of display technology, and provides a display apparatus, a display substrate, and a method of preparing a display substrate. The display substrate includes a display area and a frame area surrounding the display area, and further includes: a drive circuit layer provided on a base substrate; an insulating material structure provided on the drive circuit layer, located in the display area and at least a portion of the frame area, and provided with a step structure at an edge thereof; a light-emitting layer provided on the insulating material structure; an encapsulation layer covering the light-emitting layer; a first barrier wall provided on the drive circuit layer, and surrounding the insulating material structure, where the edge is an edge of the insulating material structure close to the first barrier wall; and a conductive connection structure provided inside the insulating material structure and electrically connected with the drive circuit layer. The present disclosure can avoid circuit defects.