Display Substrate Stress-Absorbing Portions for Crack Prevention

The patent transitions from two-dimensional groove structures on the surface to three-dimensional stress absorbing portions extending into the thickness direction of the substrate. By creating cavities that penetrate through or partially through the substrate thickness and filling them with stress-absorbing materials, the solution addresses crack prevention in the vertical dimension rather than only horizontally, thus preventing crack propagation without increasing frame width.

The patent changes the physical and chemical parameters of the material by introducing stress-absorbing materials with different mechanical properties (lower Young's modulus, higher Poisson's ratio) into the substrate structure. This material parameter change allows the structure to absorb stress and prevent cracks without requiring additional horizontal space, thereby maintaining narrow frame width while improving reliability.

The patent implements stress-absorbing portions before the cutting process occurs, creating a preventive mechanism that cushions against future stress. By pre-installing materials with high stress-absorbing capabilities in the package film layer and extending into the substrate, the structure is prepared in advance to withstand cutting stresses, preventing cracks even in thinned structures that enable frame narrowing.

The patent creates a composite structure by combining the package film layer material with stress-absorbing materials having different mechanical properties. This composite approach allows the thinned package film to be reinforced by the stress-absorbing portions, maintaining crack resistance despite reduced thickness, thus enabling frame narrowing without sacrificing strength.