Display Substrate with Through and Blind Holes for Sensor Integration
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Solution Overview
Problem
Existing display technologies that incorporate optical sensors, such as cameras, through hole-in-display designs sacrifice display area and hinder the achievement of a high screen-to-body ratio due to the need for encapsulation structures around through holes, while blind hole designs compromise sensor performance with reduced transmittance.
Innovation Solution
A display substrate design that integrates both through and blind holes, allowing high-transmittance sensors like cameras in through holes and lower-transmittance sensors like infrared sensors in blind holes, without requiring encapsulation structures, thereby optimizing the screen-to-body ratio and maintaining sensor effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If hole-in-display technology is used to integrate optical sensors, then sensor integration is achieved, but display area is sacrificed and screen-to-body ratio is reduced
Solution Approach 1:
The patent divides the hole structure into two distinct types: through holes for high-transmittance sensors (cameras) and blind holes for low-transmittance sensors (infrared sensors). This segmentation allows different sensor types to be accommodated with appropriate light transmittance characteristics, eliminating the need to sacrifice display area for encapsulation structures while maintaining sensor integration
Solution Approach 2:
The patent applies different structural qualities to different regions: through holes provide high light transmittance for camera sensors, while blind holes provide light blocking for infrared sensors. This local differentiation optimizes each sensor's performance without requiring uniform encapsulation across the entire display area, thereby preserving screen-to-body ratio
2Reliability
If encapsulation structures are added around through holes to protect sensors, then sensor protection is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts the encapsulation requirement only where absolutely necessary (around through holes for camera protection) while eliminating it for blind holes. This selective approach reduces overall device complexity and manufacturing difficulty compared to universal encapsulation, while still providing sensor protection where needed
Solution Approach 2:
Instead of using encapsulation to achieve light blocking (as in blind holes), the patent inverts the approach by using the absence of encapsulation and the hole structure itself to achieve light blocking functionality. This simplifies the structure while maintaining sensor protection and performance
3Device complexity
If blind holes are used for all sensors to simplify structure, then device complexity is reduced, but sensor performance deteriorates due to reduced transmittance
Solution Approach 1:
The patent applies different structural qualities to different sensor requirements: through holes provide high light transmittance for camera sensors that require maximum light intake, while blind holes provide light blocking for infrared sensors. This local differentiation ensures each sensor operates at optimal performance without compromising overall device complexity
Solution Approach 2:
The patent segments the hole structure into through holes and blind holes based on sensor type and transmittance requirements. This segmentation allows high-transmittance sensors to receive adequate light while low-transmittance sensors maintain their functionality, preserving sensor performance without requiring a completely complex encapsulation system
Data Source
AI summary
A display substrate has at least two wiring areas, a hole border area surrounding the wiring areas, a display area surrounding the hole border area, at least one through hole area, at least one blind hole area. The blind hole area is light-transmitting. Each through hole area and each blind hole area are both surrounded by a respective wiring area. The display substrate includes a base substrate having a through hole in each through hole area, and a driver circuit layer which includes at least one metal layer located in the display area and the wiring areas, and at least one insulating layer located in the display area, the hole border area, the wiring areas, and the at least one blind hole area. The metal layer includes a plurality of signal lines arranged to avoid the at least one through hole area and the at least one blind hole area.