Display Substrate Through-Hole Routing for Zero-Bezel Panels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display substrates, such as OLED panels, require bezels to accommodate scanning and data lines connected to GOA and ICs, preventing the realization of a narrow or zero bezel design and full-screen display.
Innovation Solution
The display substrate design includes a base substrate with conductive structures through holes that connect signal lines to bonding electrodes on the opposite surface, allowing drive circuits like GOA and ICs to be integrated within the display area without needing a bezel, achieved through manufacturing methods involving through-hole formation and conductive structure filling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional bezel design is used to accommodate scanning and data lines connected to GOA and ICs, then electrical connection and signal transmission are ensured, but bezel width increases and full-screen display is prevented
Solution Approach 1:
The patent applies dimensionality change by routing signal lines through the thickness dimension of the substrate rather than along the edges. Through-holes penetrate the substrate thickness, allowing signal lines to connect between opposite surfaces, thereby eliminating the need for lateral bezel space and enabling full-screen display while maintaining electrical connectivity.
Solution Approach 2:
The patent implements nesting by embedding conductive structures within the substrate thickness. The through-holes containing conductive materials are nested inside the substrate body, allowing multiple signal paths to be integrated within the substrate volume without increasing external dimensions, thus achieving compact routing without additional bezel width.
2Length of stationary object
If drive circuits are integrated within the display area, then bezel width is reduced, but manufacturing complexity increases due to through-hole formation and conductive structure filling
Solution Approach 1:
The patent applies preliminary action by forming through-holes and filling conductive structures during the substrate manufacturing process before final assembly. The through-holes are created and conductive materials are deposited in advance, allowing subsequent signal line routing and component integration to proceed without additional complex steps, thereby reducing overall manufacturing complexity despite the integrated design.
Data Source
AI summary
A display substrate and a manufacturing method therefor, a display panel, and a display device. The display substrate comprises a base substrate; a drive circuit arranged in an array in a display area on a first surface of the base substrate; a bonding electrode located on a second surface of the base substrate and arranged in the display area; a signal line located in the display area, one end of the signal line is electrically connected to the bonding electrode, and the other end is electrically connected to the drive circuit; and a conductive structure at least filled into a through hole at least passing through the base substrate, the conductive structure is configured to connect the signal line, the drive circuit and the bonding electrode.