Display Substrate Layout With Through-Insulator Interconnects
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Solution Overview
Problem
Existing display devices have a large non-display area boundary, limiting the effective display space as the processing unit and display unit are formed on the same surface of the substrate.
Innovation Solution
The display device includes an insulating layer with a first and second conductive portion on opposite sides, a connective portion partially disposed in the insulating layer for electrical connection, a processing unit, and an electronic element, allowing for efficient signal transmission without occupying additional display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the processing unit and display unit are formed on the same surface of the substrate, then the device structure is simplified, but the effective display space is limited due to large non-display area boundary
Solution Approach 1:
The patent moves the processing unit from the same surface (2D plane) to the back surface of the substrate, utilizing the third dimension (depth/thickness) to resolve the space conflict. This allows the display unit to occupy the entire front surface while the processing unit occupies the back surface, eliminating the need for non-display area boundaries.
Solution Approach 2:
The patent divides the substrate into two functional surfaces: the front surface for the display unit and the back surface for the processing unit. This segmentation allows each unit to occupy its designated surface independently, maximizing the effective display area on the front while accommodating processing components on the back.
2Reliability
If conductive portions are extended to connect processing unit and display unit on the same surface, then electrical connection is achieved, but the non-display area increases
Solution Approach 1:
The conductive portions are routed through the thickness of the substrate to connect the display unit on the front surface with the processing unit on the back surface. This vertical routing through the substrate eliminates the need for horizontal conductive traces that would consume valuable display area on the front surface.
Data Source
AI summary
An electronic device includes an insulating layer, a first conductive portion, a second conductive portion, a connective portion, a processing unit and an electronic element. The first conductive portion and the second conductive portion are respectively corresponding to opposite sides of the insulating layer. The connective portion is at least partially disposed in the insulating layer. The first conductive portion is electrically connected to the second conductive portion through the connective portion. The processing unit and the electronic element are respectively corresponding to opposite sides of the insulating layer. The processing unit and the electronic element are overlapped with the connective portion. The thickness of the processing unit is greater than the thickness of the first conductive portion.