Display Substrate Via Conduction for Mini-LED Yield
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Solution Overview
Problem
Mini-LED/Micro-LED display technology faces low yield due to challenges in mass transfer and potential impairment of drive thin film transistors during the bonding process of light emitting diode chips.
Innovation Solution
A display substrate design with a substrate separating the drive thin film transistor and the light emitting diode chip, using a first via filled with a conductive section for electrical contact, and a method for fabricating this substrate involving etching and electroplating to ensure reliable electrical connections and prevent transistor impairment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the drive thin film transistor and light emitting diode chip are placed on the same side of the substrate, then the device structure is simplified, but the drive thin film transistor may be impaired during the bonding process of the light emitting diode chip
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement where both the drive thin film transistor and light emitting diode chip are on the same side of the substrate, to a three-dimensional spatial arrangement where they are separated onto opposite sides of the substrate. This dimensional change eliminates the harmful interaction during bonding while maintaining electrical connectivity through the substrate via conductive sections in vias.
2Reliability
If the drive thin film transistor and light emitting diode chip are separated onto opposite sides of the substrate, then the transistor is protected from impairment during bonding, but the electrical connection between them becomes more complex
Solution Approach 1:
The substrate acts as an intermediary element that facilitates electrical connection between the drive thin film transistor and light emitting diode chip while they are positioned on opposite sides. Conductive sections embedded in vias through the substrate serve as intermediary conductors, establishing electrical pathways without requiring direct contact between the transistor and LED chip, thus simplifying the overall connection structure despite the spatial separation.
3Productivity
If conventional bonding processes are used for Mini-LED/Micro-LED chips, then the production speed is maintained, but the yield is reduced due to potential impairment of drive thin film transistors
Solution Approach 1:
The patent implements preliminary spatial separation of the drive thin film transistor and light emitting diode chip onto opposite sides of the substrate before the bonding process begins. This preliminary arrangement prevents potential impairment of the transistor during subsequent bonding operations, allowing conventional bonding processes to proceed without compromising transistor integrity, thereby maintaining both production speed and yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the yield of the display substrate by preventing impairment of the drive thin film transistor during the bonding process and ensuring reliable electrical connections, enabling the production of high-quality Mini-LED/Micro-LED displays.
Implementation Method 1
the first lead is in electrical contact with the first terminal through the first conductive section
Implementation Method 2
a method for fabricating this substrate involving etching and electroplating
Data Source
AI summary
A display substrate, a method for fabricating the same, and a display device are provided. The display substrate includes: a substrate 100 that includes a first via filled with a first conductive section 4011; a drive thin film transistor that is placed on a first side of the substrate and includes a first terminal 2051; and a light emitting diode chip 300 that is placed on a second side of the substrate distal to the drive thin film transistor; wherein the light emitting diode chip 300 includes a first lead 301 and a second lead 302; the first lead 301 is in electrical contact with the first terminal 2051 through the first conductive section 4011; and the second lead 302 is in electrical contact with a second electrode 402 that is placed on the second side of the substrate.