Display Substrate Via Holes for Overcurrent Protection
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Solution Overview
Problem
In display substrates, the via holes connecting signal lines and signal introduction lines are prone to overheating and burning out due to static electricity, leading to signal transmission issues.
Innovation Solution
The display substrate incorporates a connection structure with multiple via holes of varying contact areas and shapes, including recesses, to distribute heat and reduce resistance, ensuring that current is shunted through multiple paths, thereby minimizing heat generation and preventing via hole burnout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple via holes are used to connect signal lines, then current distribution is improved and heat generation is reduced, but manufacturing complexity increases due to varying contact areas and shapes
Solution Approach 1:
The connection structure divides the current path into multiple via holes instead of using a single via hole. Each via hole serves as an independent current channel, distributing the total current and reducing heat generation in any single via hole. This segmentation approach directly addresses the reliability issue by preventing via hole burnout from overcurrent or static electricity.
Solution Approach 2:
Adjacent via holes are designed with different contact areas with the conductive layer, creating local quality variations. Via holes with larger contact areas have lower resistance and handle more current, while smaller via holes have higher resistance. This non-uniform design optimizes current distribution and heat dissipation across the connection structure, improving overall reliability.
2Reliability
If via holes with different contact areas are used, then current distribution is optimized and heat generation is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent intentionally designs via holes with different contact areas as a local quality feature. By making adjacent via holes have different contact areas with the conductive layer, the patent creates a current distribution pattern where larger via holes carry more current and smaller via holes carry less current. This optimizes heat dissipation and current management, addressing the reliability concern while the manufacturing process is designed to accommodate these intentional variations.
3Reliability
If recesses are added to via holes, then heat distribution is improved and burnout risk is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The via hole structure is segmented by adding recesses (grooves) along the via hole walls. These recesses divide the via hole into multiple sections, increasing the surface area for heat dissipation and improving thermal management. The segmentation also creates multiple current paths within the via hole, further distributing heat generation and reducing the risk of localized overheating and burnout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the risk of via hole burnout by distributing heat and current across multiple paths, ensuring reliable signal transmission even during overcurrent events.
Implementation Method 1
The second conductive layer is connected to the first conductive layer through a plurality of via holes in the at least one insulating layer
Implementation Method 2
at least two of the plurality of via holes have different contact areas with the first conductive layer
Data Source
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AI summary
A display substrate may include at least one connection structure (1) in a non-display area (89) of the display substrate. The at least one connection structure (1) may include a first conductive layer (11), at least one insulating layer (19) on the first conductive layer (11), and a second conductive layer (12) on a side of the at least one insulating layer (19) opposite from the first conductive layer (11). The second conductive layer 12) may be connected to the first conductive layer (11) through a plurality of via holes (3) in the at least one insulating layer (19), and at least two of the plurality of via holes (3) may have different contact areas with the first conductive layer (11). The display substrate can be at least partially solves the problem that the through hole is easy to be burnt when over-current problem.