Display Substrate Connection Structure for Common Electrode Voltage Recovery

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Solution Overview

Problem

High refresh rate display products, such as esports displays, experience residual images due to the inability of common electrode voltages to be restored after coupling with data voltages, leading to issues like Mura defects and uneven display.

Innovation Solution

A display substrate design with a connection structure that includes via-holes and conducting sub-portions in different conductive layers, optimizing the length-width ratios and overlap of these components to enhance common electrode voltage restoration and reduce resistance, using half via-holes to facilitate PI liquid diffusion and improve Mura defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If the refresh rate is increased to 500 Hz, then the scanning time for a single line is reduced to 1.8 μs, but the common electrode voltage cannot be restored after being coupled with data voltage, leading to residual images

Engineering Contradiction:
Improverefresh rateVSAvoidvoltage restoration
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The connection structure is divided into two separate conducting sub-portions located in different conductive layers. The first conducting sub-portion is in the first conductive layer and the second conducting sub-portion is in the second conductive layer, creating parallel conduction paths that segment the current flow and improve voltage restoration capability at high refresh rates

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single-layer connection to a multi-layer three-dimensional structure. By utilizing multiple conductive layers with via-holes connecting them, the patent adds vertical dimensionality to the connection structure, enabling parallel conduction paths that restore common electrode voltage effectively even at 500 Hz refresh rates

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If a single conducting portion is used to connect common electrodes, then the device complexity is reduced, but the resistance is higher and voltage restoration is insufficient

Engineering Contradiction:
Improveconnection structureVSAvoidvoltage restoration
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The connection structure is segmented into multiple conducting sub-portions distributed across different conductive layers. Each sub-portion provides an independent conduction path, and their combined effect reduces overall resistance and improves voltage restoration without requiring excessive complexity in any single component

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple conducting sub-portions in different conductive layers are merged to form a unified connection structure. The via-holes electrically connect the conducting sub-portions across layers, creating a combined parallel conduction system that achieves low resistance and effective voltage restoration while maintaining manageable device complexity

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If via-holes with large overlap are used, then the electrical connection is improved, but the PI liquid diffusion is hindered, causing Mura defects

Engineering Contradiction:
Improveelectrical connectionVSAvoidMura defects
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The via-holes are designed with different length-width ratios depending on their location and function. The first via-hole has a smaller length-width ratio (X1 ≤ 0.8) to facilitate PI liquid diffusion and prevent Mura defects, while the second via-hole has a larger length-width ratio (X2 ≥ 1.2) to ensure adequate electrical connection, creating local optimization of via-hole geometry

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves the uniformity of common electrode resistance and enhances the restoration of common electrode voltage, reducing residual images and improving display uniformity in high refresh rate displays.

Implementation Method 1

the first connection portion is electrically connected to the first common electrode through a first via-hole, and the second connection portion is electrically connected to the second common electrode through a second via-hole

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

using half via-holes to facilitate PI liquid diffusion and improve Mura defects

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS20260020345A1Display substrate and display device
Publication Date: 2026.01.15 BEIJING BOE DISPLAY TECH CO LTD
  • US20260020345A1 patent drawing
  • US20260020345A1 patent drawing
  • US20260020345A1 patent drawing

AI summary

A display substrate and display device are provided. The display substrate includes a connection structure, a first common electrode, a second common electrode, a first conductive layer, and a second conductive layer, the connection structure includes a first connection portion, a second connection portion, and a conducting portion; the first connection portion is electrically connected to the first common electrode through a first via-hole, and the second connection portion is electrically connected to the second common electrode through a second via-hole; the conducting portion includes a first conducting sub-portion and a second conducting sub-portion; the first connection portion is electrically connected to the second connection portion through the first conducting sub-portion, and the first connection portion is electrically connected to the second connection portion through the second conducting sub-portion; a length-width ratio of the first via-hole is X1, and a length-width ratio of the second via-hole is X2, with X1<1<X2.