Display Substrate Wiring Layout for Narrower Inclined Frames
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Solution Overview
Problem
The increasing number of source wiring lines in high-definition liquid crystal display devices leads to a wider non-display region frame width, particularly at inclined side portions, due to the need for additional lead-out wiring lines, which is exacerbated in non-rectangular displays.
Innovation Solution
The display substrate design includes intersecting and overlapping wiring lines in the non-display region, utilizing multiple conductive films separated by insulating films to optimize wiring layout, reducing the space required for lead-out wiring lines and minimizing the frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of source wiring lines is increased to achieve higher definition, then the image quality is improved, but the number of lead-out wiring lines increases resulting in a wider frame width
Solution Approach 1:
The patent applies dimensionality change by routing lead-out wiring lines through three-dimensional space using overlapping configurations at different heights. The first and second lead-out wiring lines are disposed to overlap each other in the plan view, utilizing the vertical dimension to reduce horizontal space occupation. This allows multiple wiring lines to share the same planar footprint by stacking them at different elevations, thereby reducing the frame width while maintaining support for high-definition source wiring lines.
2Ease of operation
If lead-out wiring lines are routed in the non-display region to connect source wiring lines, then the wiring connectivity is achieved, but the frame width near inclined side portions becomes wider
Solution Approach 1:
The patent utilizes vertical stacking to route lead-out wiring lines through the non-display region. The first lead-out wiring line extends from the first source wiring line to the first signal supply unit, while the second lead-out wiring line extends from the second source wiring line to the first signal supply unit. These lines are configured to overlap in plan view, using the vertical dimension to minimize their horizontal footprint near inclined side portions, thereby maintaining wiring connectivity without excessive frame width expansion.
Solution Approach 2:
The patent merges the routing paths of multiple lead-out wiring lines by disposing them to overlap each other in the plan view. The first and second lead-out wiring lines share portions of the same spatial corridor in the non-display region, effectively combining their routing paths. This merging approach reduces the total space required for wiring while maintaining electrical connectivity between source wiring lines and the signal supply unit.
Data Source
AI summary
A first wiring and a second wiring both intersect with a first inclined side portion, a third wiring has a first wiring unit made of a part of a first conductive film and a second wiring unit made of a part of a first metal film or a second conductive film, the second wiring unit is connected to the first wiring unit and the first wiring, a fourth wiring has a third wiring unit made of a part of the second metal film and a fourth wiring unit made of a part of the first metal film or the second metal film, the third wiring unit is arranged to overlap the first wiring unit, and the fourth wiring unit is arranged not to overlap the second wiring unit and is connected to the third wiring unit and the second wiring.