Display Device Support Frame Integrating Thermal Conduction and Structural Fixing
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Solution Overview
Problem
Conventional display devices with modular structures face challenges in weight distribution, leading to potential damage to functional components due to the heavy weight of module portions, and require separate heat dissipation structures, which complicates the design and increases costs.
Innovation Solution
A display device design that integrates a housing with a support frame to fix both the functional component and the backlight module, using the housing as a thermally conductive structure for heat dissipation, eliminating the need for a separate heat dissipation structure and simplifying the modular design by omitting the front and middle frames.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If modular device structure is used with separate front frame and middle frame, then structural strength is improved, but device complexity and weight increase
Solution Approach 1:
The patent integrates the front frame and middle frame into a single support frame structure. The support frame extends from the front housing into the receiving chamber, combining the functions of both the front frame (supporting functional components) and the middle frame (supporting the display panel), thereby reducing structural complexity while maintaining strength
Solution Approach 2:
The support frame serves multiple functions simultaneously: it supports functional components (touch screen, protective glass), supports the display panel, and provides thermal conduction for heat dissipation. This multi-functional design eliminates the need for separate frames while maintaining structural integrity
2Temperature
If separate heat dissipation structure is added, then heat dissipation efficiency is improved, but device complexity and cost increase
Solution Approach 1:
The support frame is designed with dual functionality: mechanical support and thermal conduction. By incorporating thermally conductive material into the support frame structure, the patent eliminates the need for a separate heat dissipation structure, reducing device complexity while maintaining effective heat dissipation from the display panel and functional components
Solution Approach 2:
The thermal conduction function is merged into the support frame structure itself. The support frame contains thermally conductive material that directly contacts the display panel and functional components, creating an integrated heat dissipation pathway without requiring additional dedicated heat dissipation components
3Stability of the object's composition
If heavy module portions are used for support, then structural stability is improved, but weight on functional components increases causing potential damage
Solution Approach 1:
The patent changes the material parameter of the support frame by incorporating thermally conductive material that also provides structural strength. This allows the support frame to maintain structural stability while being optimized for weight distribution, avoiding the need for excessively heavy module portions
Solution Approach 2:
The support frame is designed as an extended structure that distributes weight across multiple attachment points to the front housing and receiving chamber. This segmentation of the support function across the extended frame structure reduces concentrated weight on functional components while maintaining overall structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the weight burden on functional components, enhances heat dissipation efficiency, and simplifies the structural complexity, improving the reliability and cost-effectiveness of the display device while maintaining high strength and performance.
Implementation Method 1
an inner side of the support frame is in thermally conductive connection with the light source so that the housing is served as a heat dissipation structure of the light source
Data Source
AI summary
A display device is provided. The display device includes: a housing, a display panel, a backlight module, and a functional component. The housing includes a receiving chamber having an opening and a front housing located at a side of the receiving chamber where the opening is located, the front housing includes a support frame extending into the receiving chamber; the display panel is located inside the receiving chamber; the backlight module is located at a side of the display panel away from the opening; the functional portion is located at a side of the display panel away from the backlight module. The support frame is configured to fix the functional component and to fix the backlight module, and at least one of the functional component or the support frame is bonded with the display panel to fix the display panel.