Display Panel Support Structure With Thin Heat Conduction Layer

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional image display devices, particularly those with organic EL panels, face challenges in efficiently dissipating heat generated during light emission, leading to display irregularities such as color and luminance issues due to local temperature increases caused by air bubbles and uneven attachment of support members.

Innovation Solution

An image display device design featuring a plate-like heat conduction member with a thickness less than the separation distance between the display panel and the support member, maintaining a narrow air gap to uniformly dissipate heat while allowing for easy assembly and reusability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a support member is pressed against the back surface of the display panel using screw fastening power, then heat dissipation is improved, but display irregularities occur due to local temperature increases caused by air bubbles and uneven attachment

Engineering Contradiction:
Improveheat dissipationVSAvoiddisplay uniformity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The support member is divided into a frame portion and a plate portion that are separated by a predetermined distance, creating a spaced structure. This segmentation prevents the support member from directly pressing against the display panel, eliminating air bubbles and uneven attachment while maintaining heat dissipation functionality through the plate portion's proximity to the panel.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A heat conduction member is introduced as an intermediary between the display panel and the support member's plate portion. This heat conduction member has a thermal conductivity lower than that of the display panel, acting as a thermal mediator that enables uniform heat dissipation while preventing direct mechanical contact that would cause display irregularities.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the support member is attached close to the display panel for heat dissipation, then heat dissipation efficiency is improved, but manufacturing complexity increases due to need for precise spacing control

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidassembly complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The support member is segmented into frame and plate portions with built-in spacing structures. The plate portion includes protrusions that engage with recesses in the frame portion, automatically maintaining the predetermined distance. This integrated spacing design eliminates the need for separate spacers or complex assembly procedures, simplifying manufacturing while ensuring optimal heat dissipation spacing.

Inventive Principle:
Principle #1Segmentation

3Temperature

If a thick heat conduction member is used to fill the separation distance, then heat conduction is improved, but the device thickness increases and manufacturing flexibility is reduced

Engineering Contradiction:
Improveheat conductionVSAvoiddevice thickness
Core Design Contradiction:
TemperatureVSLength of stationary object

Solution Approach 1:

The heat conduction member is designed with optimized thickness and thermal conductivity parameters. Rather than using a thick member to fill the entire separation distance, the invention uses a thinner heat conduction member with appropriately selected thermal conductivity properties. This parameter optimization achieves effective heat conduction while maintaining the predetermined spacing and avoiding excessive device thickness.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves heat dissipation uniformity, reducing display irregularities and enabling efficient manufacturing with the potential for reusing components, thus enhancing image quality.

Implementation Method 1

a heat conduction member that is plate-like, is disposed between the display panel and the support member

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12513871B2Image display device
Publication Date: 2025.12.30 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US12513871B2 patent drawing
  • US12513871B2 patent drawing
  • US12513871B2 patent drawing

AI summary

An image display device includes: a display panel that displays an image on a front surface; a support member that is plate-like and is disposed on a back surface side of the display panel; a fixing member; and a heat conduction member. The fixing member fixes the display panel to the support member with a distance therebetween. The heat conduction member is disposed between the display panel and the support member. The heat conduction member is a plate-like member, and has a thickness less than a separation distance between the display panel and the support member.