Display Support Assembly With Segmented Heat Dissipation Layout
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Solution Overview
Problem
Display devices face operational limitations due to heat buildup in circuit board assemblies, which can impair the efficient and stable operation of components and affect the normal functioning of the display device.
Innovation Solution
A support assembly for display devices is introduced, featuring a housing with a mounting cavity that houses a circuit board assembly and a heat dissipation assembly. The heat dissipation assembly, comprising a mainboard heat dissipation member and a logic board heat-dissipation member, effectively transfers heat from the circuit board assembly to the housing, facilitating efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board assembly is integrated into the display device housing, then the device structure is compact and simplified, but heat dissipation becomes insufficient leading to overheating and unstable operation
Solution Approach 1:
The patent divides the housing into multiple segments: a first housing portion containing the circuit board assembly, and a second housing portion containing the display component. This segmentation allows independent thermal management for each component, enabling effective heat dissipation from the circuit board while maintaining a compact integrated structure.
Solution Approach 2:
The patent introduces a heat dissipation assembly as an intermediary component between the circuit board assembly and the external environment. This assembly includes heat dissipation members with heat dissipation surfaces that facilitate heat transfer from the circuit board to the surrounding air, effectively managing thermal conditions without compromising device integration.
2Device complexity
If the circuit board assembly is placed close to the display component, then the device structure is simplified, but the transparent display effect is compromised due to heat and component interference
Solution Approach 1:
The patent segments the housing into distinct portions: the first housing portion for the circuit board assembly and the second housing portion for the display component. This spatial segmentation maintains the transparent display effect by isolating the display from heat-generating components while preserving overall structural simplicity through the integrated housing design.
3Ease of manufacture
If traditional heat dissipation methods are used without integrating heat dissipation assembly, then the manufacturing process is simpler, but heat dissipation efficiency is insufficient leading to unstable operation
Solution Approach 1:
The patent merges the heat dissipation assembly with the housing structure, integrating thermal management functionality into the existing device framework. The heat dissipation members are incorporated into the housing portions, combining structural support and heat dissipation functions, which maintains manufacturing simplicity while significantly improving heat dissipation efficiency and operational reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support assembly ensures efficient and stable operation of the circuit board assembly and the display device by effectively dissipating heat, while also enabling a transparent display effect by separating the circuit board assembly and heat dissipation assembly from the display component.
Implementation Method 1
The heat dissipation assembly, comprising a mainboard heat dissipation member and a logic board heat-dissipation member, effectively transfers heat from the circuit board assembly to the housing
Data Source
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AI summary
A support assembly (200) and a display device are provided. The support assembly (200) is configured to support a display component (100) and includes: a housing (210) comprising a mounting cavity (211); a circuit board assembly (220) assembled in the mounting cavity (211); and a heat dissipation assembly (230) assembled to the circuit board assembly (220). The support assembly (200) dissipates heat of the circuit board assembly (220) by the heat dissipation assembly (230) to ensure efficient and stable operation of the circuit board assembly (220).