Display Support Module Structure for Screen Impact Buffering

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Solution Overview

Problem

Existing display devices face issues with support modules breaking the glass screen due to high rigidity during transportation, and the cost of double-shot injection is high.

Innovation Solution

An electronic device with a support module comprising a base and a support unit between a back plate and an optical film, featuring a hollow structure and adjustable design to reduce the risk of damage and lower production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a typical support module with high rigidity is used to support the display panel, then the structural support function is improved, but the glass screen may break during transportation when the product is squeezed, bumped or dropped

Engineering Contradiction:

Improvesupport strengthVSAvoidscreen integrity during transportation

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent introduces a buffer chamber between the support module and the glass screen that can be filled with cushioning material. This beforehand cushioning structure absorbs impact forces during transportation, preventing the glass screen from breaking while maintaining the support module's structural support function.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent employs a flexible buffer chamber design that can deform to absorb impact forces. This flexible structure allows the support module to maintain rigidity for support while providing a compliant interface that protects the glass screen from sudden impacts during transportation.

Inventive Principle:

Principle #30Flexible shells and thin films

2Manufacturing precision

If double-shot injection is used to manufacture the support module, then the integration and precision are improved, but the manufacturing cost increases

Engineering Contradiction:

Improvesupport module integrationVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent divides the support module into separate components that can be manufactured independently using simpler, lower-cost processes. These segmented components are then assembled together, achieving the necessary integration and precision without requiring expensive double-shot injection molding.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent combines multiple separately manufactured components into an integrated support module assembly. By merging independently produced parts with standardized interfaces, the patent achieves high integration and precision while avoiding the high costs associated with complex multi-material injection molding processes.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12529929B2Electronic device

Publication Date: 2026.01.20 INNOLUX CORP

AI summary

An electronic device includes: a back plate; an optical film disposed on the back plate; a support module disposed between the back plate and the optical film; and an adhesive layer disposed between the back plate and the support module, wherein the support module includes a base and a support unit between the base and the optical film, and the base is fixed to the back plate by the adhesive layer.