Display Support Assembly With Housing-Based PCB Heat Dissipation
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Solution Overview
Problem
The challenge in display devices is the heat dissipation from circuit board assemblies, which affects the efficient and stable operation of components, particularly in transparent display screens where the circuit boards need to be separated from the screen to maintain transparency.
Innovation Solution
A support assembly with a housing containing a mounting cavity for the circuit board assembly and a heat dissipation assembly that transfers heat from the circuit board to the housing, utilizing metal heat dissipation members and thermally conductive adhesives to facilitate efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board assembly is integrated into the display device, then the device structure is compact, but heat dissipation becomes difficult and component stability deteriorates
Solution Approach 1:
The patent divides the circuit board assembly into separate modules (main board, power supply board, audio board) that can be independently arranged and heat-managed within the housing, allowing compact integration while maintaining thermal performance through modular segmentation
Solution Approach 2:
The patent introduces a heat dissipation assembly as an intermediary component between the circuit board assembly and the housing, using heat dissipation members and adhesives to transfer and dissipate heat, thereby resolving the conflict between compact integration and thermal management
2Temperature
If heat dissipation structures are added to the circuit board assembly, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing housing structure by coupling heat dissipation members to the housing inner wall, creating a combined structural-thermal management system that improves heat dissipation without adding independent complex subsystems
Solution Approach 2:
The housing serves multiple functions: structural support, mounting for circuit boards, and heat dissipation surface. The heat dissipation members are integrated into this multi-functional design, allowing the same structural elements to perform both mechanical and thermal management roles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures the efficient and stable operation of the circuit board assembly and display device, allowing for a transparent display effect by effectively dissipating heat from the circuit boards, even in compact and high-temperature environments.
Implementation Method 1
a heat dissipation assembly assembled to the circuit board assembly
Data Source
AI summary
A support assembly configured to support a display component, includes: a housing comprising a mounting cavity; a circuit board assembly assembled in the mounting cavity; and a heat dissipation assembly assembled to the circuit board assembly.