Display Device Support Plate Openings for Driver Circuit Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Organic light-emitting diode displays face challenges in efficiently dissipating heat from driver circuits, which can impact performance and reliability.
Innovation Solution
Incorporating a support plate with grooves or holes that overlap with driver circuits, allowing for increased air contact and efficient heat dissipation, along with the use of heat dissipation members and adhesive layers to enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a support plate with grooves or holes is added to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The support plate is designed with grooves or holes that create a porous structure, allowing air to flow through and contact the driver circuit. This porous configuration increases the surface area for heat exchange and improves heat dissipation efficiency without requiring complex active cooling systems
Solution Approach 2:
The support plate is segmented by dividing it into multiple regions with grooves or holes at different locations. This segmentation allows targeted heat dissipation at specific areas where driver circuits are mounted, improving overall heat management while maintaining structural integrity
2Temperature
If the width of grooves or holes is increased to enhance heat dissipation, then heat dissipation efficiency is improved, but structural strength decreases
Solution Approach 1:
The support plate features non-uniform groove or hole widths at different locations, optimized according to the local heat dissipation requirements and structural strength demands. Areas with higher heat generation have wider grooves or holes for better heat dissipation, while areas requiring structural support have narrower features to maintain strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively disperses heat from driver circuits, improving the heat dissipation effect and overall performance of the display device.
Implementation Method 1
a support plate overlapping with the display panel and having a groove or hole overlapping with the first driver circuit
Implementation Method 2
a heat dissipation member disposed in the groove or the hole of the support plate
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present invention relates to a display device, and more particularly to a display device that can efficiently dissipate heat from a driver circuit, and an electronic device including the same. According to an aspect of the present invention, there is provided a display device including: a display panel; a first driver circuit connected to the display panel; and a support plate overlapping with the display panel. The support plate may have a groove or a hole that overlaps with the first driver circuit.