Display Terminal Shielding for Corrosion Resistance
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Solution Overview
Problem
Conventional liquid crystal display panels face reliability issues due to corrosion of terminal wiring in high-temperature and high-humidity environments, where exposed conductive layers are susceptible to moisture and electric field-induced corrosion, leading to potential disconnection of terminals.
Innovation Solution
A terminal structure for liquid crystal display devices is designed with a conductive thin film covered by an insulating film, featuring a shielding line that surrounds the terminal surface, electrically connected to the terminal wiring at spaced-apart positions, providing electric field shielding and protection from moisture, thus enhancing the reliability of signal input terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the conductive layer is exposed to form the terminal surface, then the terminal can receive external signals, but the conductive layer becomes susceptible to corrosion from moisture and electric fields in high-temperature and high-humidity environments
Solution Approach 1:
An insulating film is formed to cover the conductive layer, creating a protective barrier that prevents moisture and electric fields from reaching the conductive material. This thin film structure maintains the terminal's signal reception function while providing corrosion protection in harsh environments.
Solution Approach 2:
The insulating film acts as an intermediary layer between the external environment (moisture, electric fields) and the conductive layer. This mediator allows the terminal to receive signals through the film while preventing direct contact between corrosive elements and the conductive material.
2Area of stationary object
If the terminal wiring is arranged in the periphery region, then the display region can be maximized, but the terminal wiring and terminals become vulnerable to environmental corrosion
Solution Approach 1:
The insulating film is extended to cover the terminal wiring in the periphery region, providing continuous protection along the entire signal path from the external terminal through the wiring to the display region. This allows maximum display area while ensuring wiring durability.
3Ease of manufacture
If the terminal structure uses a simple exposed conductive layer, then the manufacturing process is simplified, but the terminal suffers from corrosion and potential disconnection
Solution Approach 1:
The insulating film is formed using standard thin film deposition techniques that can be integrated into existing manufacturing processes. This adds minimal complexity to fabrication while dramatically improving terminal connection stability by preventing corrosion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed terminal structure effectively prevents corrosion of both the conductive thin films and wiring, improving the reliability of signal input terminals by blocking electric fields and preventing moisture intrusion, thereby delaying the onset of disconnection in harsh environmental conditions.
Implementation Method 1
the second portion being formed of one of a conductive thin film covered with an insulating film and formed in the same layer as the first terminal wiring and a conductive thin film covered with an insulating film and formed in a different layer from the first terminal wiring, the second portion being electrically connected to the first terminal wiring at a position spaced apart from a connection portion of the first terminal wiring and the first portion
Data Source
AI summary
A display device includes a transparent substrate having a display region with a plurality of scanning signal lines and video signal lines intersecting thereon, a first terminal formed outside the display region connecting to a first terminal wiring and a second terminal wiring connected to a semiconductor chip, and an inverted staggered thin film transistor. The first terminal includes a first portion, a second portion on the first portion, a third portion having an exposed planar terminal plate on the second portion, a plurality of first vias between the first portion and the second portion, and a plurality of second vias between the second portion and the third portion. The first portion is connected to the first and second terminal wirings, and each of the plurality of first vias is not overlapped with each of the plurality of second vias in plan view.