Display Device Triple-Layer Heat Dissipation to Reduce Thermal Stress
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Solution Overview
Problem
Existing display devices face issues with thermal stress due to heat generated by circuit components, particularly around the driver IC and PCB, leading to non-uniform temperature distribution and potential separation of bonding layers.
Innovation Solution
A heat dissipation module with a triple structure comprising first and second thermal deformation media and a thermal conduction medium is used to absorb and transfer heat from the circuit components to a reinforcement plate, ensuring uniform temperature distribution and minimizing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat dissipation sheet with a cut-out design is used to prevent bonding layer separation, then bonding layer separation is prevented, but temperature uniformity deteriorates due to peak temperature formation
Solution Approach 1:
A thermal deformation medium is introduced as an intermediary component between the circuit component and the heat dissipation sheet. This medium deforms thermally in response to heat, filling the gap created by the cut-out design and enabling more uniform heat distribution while maintaining bonding layer separation prevention
Solution Approach 2:
The thermal deformation medium changes its physical parameters (shape, volume, or position) in response to temperature changes. This parameter change allows the medium to adapt to thermal expansion and contraction, filling gaps dynamically and improving temperature uniformity without compromising bonding layer protection
2Use of energy by stationary object
If heat dissipation sheets are attached in a staggered manner with bonding layers, then thermal insulation is improved, but temperature uniformity deteriorates
Solution Approach 1:
The thermal deformation medium acts as a mediator that bridges the gap between the staggered heat dissipation sheet and bonding layer. It maintains thermal insulation while distributing heat more uniformly by deforming to fill the empty space between components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation module effectively diffuses heat generated by circuit components, reducing thermal stress and ensuring uniform temperature distribution, thereby preventing damage to the circuit components and reinforcement plate.
Implementation Method 1
a thermal conduction medium disposed between the first thermal deformation medium and the second thermal deformation medium and configured to transfer the heat between the first thermal deformation medium and the second thermal deformation medium
Implementation Method 2
first thermal deformation media and second thermal deformation media configured to adjoin the circuit component, absorb heat generated from the circuit component, and transfer the heat to the reinforcement plate
Data Source
AI summary
A display device may include a display panel; a reinforcement plate configured to support the display panel; a circuit component configured to operate the display panel; and a heat dissipation module configured to reduce the occurrence of thermal stress in the circuit component and the reinforcement plate by absorbing heat, which is generated from the circuit component, and transferring the heat to the reinforcement plate, wherein the heat dissipation module includes: first thermal deformation media and second thermal deformation media configured to adjoin the circuit component, absorb heat generated from the circuit component, and transfer the heat to the reinforcement plate; and a thermal conduction medium disposed between the first thermal deformation medium and the second thermal deformation medium and configured to transfer the heat between the first thermal deformation medium and the second thermal deformation medium.