Display Thermal Control Structure With Low-Emissivity Printed Layer
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Solution Overview
Problem
Existing display devices face challenges in effectively dissipating heat while maintaining a reduced thickness, which can lead to thermal damage to the display panel and circuit board components.
Innovation Solution
The display device incorporates a bottom chassis with openings overlapping circuit elements, a printed layer with low emissivity, and a heat dissipation layer to manage thermal dissipation, along with a circuit board design that includes a printed layer with emissivity of 0.3 or less and an insulating layer with similar emissivity, enhancing heat dissipation and reducing thermal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the display device is reduced, then the overall size is minimized, but heat dissipation capability deteriorates
Solution Approach 1:
The bottom chassis is segmented with multiple openings that expose the heat dissipation layer, creating separate heat dissipation zones. This segmentation allows heat to be dissipated through multiple pathways while maintaining a thin overall structure, resolving the contradiction between reduced thickness and heat dissipation capability.
Solution Approach 2:
The heat dissipation layer is positioned in the thickness dimension (between the display panel and circuit board) rather than expanding the lateral area. By utilizing the Z-axis space efficiently with the heat dissipation layer and openings in the bottom chassis, the design achieves effective heat dissipation without increasing the device's overall thickness.
2Reliability
If heat dissipation structures are added, then thermal damage is prevented, but device complexity increases
Solution Approach 1:
The heat dissipation layer is integrated into the existing structure between the display panel and circuit board, merging the heat dissipation function with the structural assembly. The bottom chassis openings are incorporated into the existing chassis design rather than adding separate components, reducing overall structural complexity while maintaining thermal protection.
Solution Approach 2:
The bottom chassis serves multiple functions: it provides structural support, defines the opening patterns for heat dissipation, and works with the heat dissipation layer to prevent thermal damage. The printed layer on the circuit board also serves dual purposes of electrical connection and thermal management, reducing the need for additional dedicated components.
3Temperature
If a printed layer with low emissivity is added, then radiant heat transfer is reduced, but manufacturing complexity increases
Solution Approach 1:
The printed layer's emissivity parameter is specifically controlled to be 0.3 or less, optimizing its ability to block radiant heat transfer. This parameter change is achieved through selecting appropriate printing materials and processes that can be integrated into existing circuit board manufacturing workflows, minimizing the increase in manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents thermal damage to the display panel and circuit board while maintaining a slim profile, improving the overall efficiency and lifespan of the display device.
Implementation Method 1
a printed layer disposed on an upper surface of the circuit base layer and having an emissivity of about 0.3 or less
Implementation Method 2
The bottom chassis includes an opening overlapping the at least one circuit element in a plan view
Implementation Method 3
The opening may include a first opening overlapping the first sub-circuit element in a plan view; and a second opening overlapping the second sub-circuit element and spaced apart from the first opening in a plan view
Data Source
AI summary
A display device includes a display panel, a bottom chassis under the display panel, and a circuit board electrically connected to the display panel and disposed under the bottom chassis. The circuit board includes a circuit base layer, at least one circuit element disposed on a lower surface of the circuit base layer, and a printed layer disposed on an upper surface of the circuit base layer and having an emissivity of about 0.3 or less. The bottom chassis includes an opening overlapping the at least one circuit element in a plan view.