Display Panel Thermal Shielding With Chassis Openings
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Solution Overview
Problem
Existing display devices face challenges in effectively dissipating heat while maintaining a reduced thickness, leading to potential thermal damage to the display panel.
Innovation Solution
The display device incorporates a bottom chassis with openings overlapping circuit elements, a circuit board with a printed layer of low emissivity, and a heat dissipation layer, along with a radiation blocking layer to enhance heat dissipation and prevent thermal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the display device is reduced, then the overall size is minimized, but heat dissipation capability deteriorates leading to thermal damage risk
Solution Approach 1:
The bottom chassis is segmented with openings that expose the heat dissipation layer, creating multiple heat dissipation pathways. This segmentation allows heat to escape through various regions rather than being trapped in a solid structure, effectively dissipating heat while maintaining thin device profile.
Solution Approach 2:
A heat dissipation layer is introduced as an intermediary component between the circuit board and the display panel. This layer acts as a thermal management mediator that conducts heat away from critical components, preventing thermal damage to the display panel while enabling thin device construction.
2Reliability
If heat dissipation structures are added to prevent thermal damage, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat dissipation layer is merged with the bottom chassis structure, and the openings in the bottom chassis serve dual purposes of structural support and heat dissipation. This merging eliminates the need for separate heat dissipation components, reducing device complexity while maintaining effective thermal management.
Solution Approach 2:
The bottom chassis is designed with multi-functionality, serving both as a structural support element and as a heat dissipation structure through its openings. This universal design allows a single component to fulfill multiple functions, avoiding additional complexity from dedicated heat dissipation structures.
3Length of stationary object
If circuit elements are positioned close to the display panel to reduce thickness, then device compactness is improved, but thermal damage risk increases
Solution Approach 1:
The heat dissipation layer positioned between the circuit board and display panel acts as a thermal mediator. It conducts heat away from the circuit elements that are necessarily close to the display panel for thin device design, preventing thermal damage while maintaining compact structure.
Solution Approach 2:
The bottom chassis features localized openings positioned to expose specific regions of the heat dissipation layer directly beneath circuit elements. This local quality enhancement targets thermal management at the most critical heat generation points without requiring changes to the entire device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat, preventing thermal damage to the display panel while reducing the overall thickness of the device.
Implementation Method 1
a printed layer disposed on an upper surface of the circuit base layer and having an emissivity of about 0.3 or less
Implementation Method 2
The bottom chassis includes an opening overlapping the at least one circuit element in a plan view
Implementation Method 3
The bottom chassis includes an opening overlapping the at least one circuit element in a plan view
Data Source
AI summary
A display device includes a display panel, a bottom chassis under the display panel, and a circuit board electrically connected to the display panel and disposed under the bottom chassis. The circuit board includes a circuit base layer, at least one circuit element disposed on a lower surface of the circuit base layer, and a printed layer disposed on an upper surface of the circuit base layer and having an emissivity of about 0.3 or less. The bottom chassis includes an opening overlapping the at least one circuit element in a plan view.