Display Substrate Through-Connection Layout for Narrow Bezels
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Solution Overview
Problem
Existing display devices have a large non-display area boundary, limiting the effective display space due to the integration of processing units and display units on the same substrate surface.
Innovation Solution
The implementation of a first insulating layer with a first connective portion that electrically connects conductive portions on opposite sides, integrating an integrated circuit and a capacitor with the connective portion, allowing signal transmission without occupying additional substrate area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the processing unit and display unit are formed on the same surface of the substrate, then the integration is achieved, but the boundary of the non-display area becomes large, limiting the effective display space
Solution Approach 1:
The patent applies dimensionality change by moving the processing unit from the same plane as the display unit to the back surface of the substrate. This spatial reconfiguration allows the display unit to occupy the entire front surface area, eliminating the non-display area boundary while maintaining functional integration through vertical stacking and conductive connections through the substrate.
2Productivity
If the processing unit is placed on the same substrate surface as the display unit, then signal transmission is simplified, but additional substrate area is occupied, reducing display space
Solution Approach 1:
The patent introduces conductive portions as intermediaries that extend through the substrate to connect the display unit on the front surface with the processing unit on the back surface. These conductive pathways serve as mediators that maintain efficient signal transmission while enabling spatial separation of functional units, thus preserving display area without sacrificing communication efficiency.
3Ease of manufacture
If processing units are integrated on the front surface with the display unit, then manufacturing is simplified, but the non-display area boundary increases, limiting effective display space
Solution Approach 1:
The patent segments the substrate into distinct functional surfaces: the front surface dedicated to the display unit and the back surface for the processing unit. This segmentation allows each unit to be optimized for its specific function while maintaining manufacturing integration through shared substrate fabrication processes and conductive connection structures that bridge the two surfaces.
Data Source
AI summary
An electronic device includes a first insulating layer and a first connective portion at least partially disposed in the first insulating layer. The electronic device includes a first conductive portion and a second conductive portion. The first conductive portion and the second conductive portion are respectively corresponding to opposite sides of the first insulating layer. The first conductive portion is electrically connected to the second conductive portion through the first connective portion. The electronic device also includes an integrated circuit and a capacitor. The integrated circuit and the capacitor are respectively corresponding to opposite sides of the first insulating layer. The integrated circuit and the capacitor are overlapped with the first connective portion.