Display Encapsulation Structure Around Through-Holes for Moisture Blocking
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Solution Overview
Problem
Display apparatuses face the challenge of preventing external moisture infiltration through through portions in the display area, which can compromise the integrity and functionality of the device.
Innovation Solution
The display apparatus incorporates a substrate with a display area and peripheral areas, featuring a thin film transistor, a display device, an encapsulation layer, and through portions surrounded by first and second grooves. The encapsulation layer includes inorganic and organic layers, and a flow-restriction portion is disposed to confine the organic encapsulation layer, effectively preventing moisture infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a through portion is formed in the display area to dispose a separate member (e.g., camera), then the functionality of the display apparatus is enhanced, but external moisture can infiltrate through the through portion into the display area
Solution Approach 1:
The encapsulation layer is divided into multiple segments: a first encapsulation layer filling the through portion, a second encapsulation layer covering the first groove, and a third encapsulation layer covering the second groove. This segmented approach allows the encapsulation structure to adapt to the complex geometry created by the through portion and grooves, effectively sealing moisture pathways while preserving the through-portion functionality for component mounting.
Solution Approach 2:
The organic encapsulation layer acts as an intermediary barrier between the external environment and the display area. It fills the through portion and extends to cover the grooves, creating a continuous protective interface that blocks moisture infiltration paths without interfering with the electrical or mechanical functionality of components disposed in the through portion.
2Area of stationary object
If the display area is increased in size while removing physical buttons, then the display area occupies more of the front surface, but grooves or through portions needed for separate members create moisture infiltration paths
Solution Approach 1:
The encapsulation structure employs a nested configuration where the first encapsulation layer is nested within the through portion, the second encapsulation layer nests over the first groove, and the third encapsulation layer nests over the second groove. This nested arrangement allows the encapsulation layers to be integrated within the existing display structure without reducing the display area, while still providing comprehensive moisture protection around all penetration points.
3Reliability
If grooves are formed to protect against moisture infiltration, then moisture protection is improved, but the structural integrity and manufacturing complexity increase
Solution Approach 1:
The solution addresses the moisture protection problem by transitioning from a two-dimensional surface coating to a three-dimensional encapsulation structure. The encapsulation layers are formed to fill vertical grooves and extend across horizontal surfaces, creating a multi-layered barrier that seals moisture pathways in three dimensions. This dimensional approach provides effective protection while maintaining compatibility with standard thin-film fabrication processes.
Data Source
AI summary
A display apparatus includes a thin film transistor disposed in a display area of a substrate and a display device in the display area that is electrically connected to the thin film transistor, an encapsulation layer that protects the display device, at least one through portion formed in the display area that vertically penetrates the substrate and a plurality of layers stacked on the substrate, and a first groove and a second groove that are spaced apart from each other and that surround the at least one through portion. A flow-restriction portion is disposed in a region between the first groove and the second groove that protrudes upwards from the substrate and confines an organic encapsulation layer of the encapsulation layer.