Display Device Through Portion Encapsulation Design
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Solution Overview
Problem
Existing display devices face challenges in minimizing damage and layer exfoliation near through portions, which can lead to structural integrity issues and moisture transmission.
Innovation Solution
A display device design featuring a substrate with a circuit element layer, a display layer, and a thin encapsulation layer, where a through portion is formed using mechanical polishing and laser irradiation, with an additional inorganic layer covering the organic layer and encapsulating the lateral surfaces, and a step difference portion with an undercut shape to prevent layer damage and moisture penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a through portion is formed in the display device, then functionality is improved, but layer damage and exfoliation occur
Solution Approach 1:
A preliminary through portion is formed before the final through portion, allowing layers to be prepared and positioned in advance. This preliminary structure serves as a guide and support during subsequent processing, preventing layer damage when the final through portion is created.
Solution Approach 2:
An additional inorganic layer is deposited to cover and protect the lateral surfaces of organic layers near the through portion. This additional layer acts as a cushioning protective barrier that prevents moisture penetration and mechanical damage to the underlying organic layers.
2Manufacturing precision
If mechanical polishing is used to form the through portion, then manufacturing precision is improved, but layer exfoliation increases
Solution Approach 1:
The preliminary through portion is formed using mechanical polishing to establish a precise path and remove material in a controlled manner before final through portion formation, reducing the risk of layer exfoliation during subsequent processing.
Solution Approach 2:
The encapsulation structure uses a composite of multiple inorganic layers and organic layers, where the additional inorganic layer provides enhanced protection to the organic layers during mechanical polishing, preventing their exfoliation while maintaining manufacturing precision.
3Productivity
If the through portion is formed directly, then productivity is improved, but moisture transmission increases
Solution Approach 1:
The preliminary through portion and additional inorganic layer are formed in advance during the manufacturing process. This allows the protective structure to be in place before the device is completed, ensuring moisture protection without requiring additional post-manufacturing steps.
Solution Approach 2:
The additional inorganic layer is deposited beforehand to cover the lateral surfaces of organic layers, creating a moisture barrier before the device is finalized. This preventive measure ensures that moisture cannot penetrate through the through portion or along the lateral surfaces of organic layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces layer damage and exfoliation, while preventing moisture transmission, thereby enhancing the structural integrity and reliability of the display device.
Implementation Method 1
the forming of the through portion is performed by using mechanical polishing which removes a portion of at least one of the thin encapsulation layer, the display layer, the circuit element layer, and the substrate
Implementation Method 2
an additional inorganic layer covering a lateral surface of the at least one organic layer that is adjacent to the through portion and the lateral surface of the display layer
Data Source
AI summary
A display device comprises a circuit element layer on a substrate and comprising a thin film transistor, a storage capacitor, and a pixel electrode connected thereto, a display layer comprising an emission layer, an opposite electrode on the emission layer, and a functional layer, a thin encapsulation layer on the display layer, the thin encapsulation layer comprising at least one inorganic layer and at least one organic layer, and a through portion passing through the substrate, the circuit element layer, the display layer, and the thin encapsulation layer, wherein a slope angle of a lateral surface of the display layer adjacent to the through portion is different from that of one of a lateral surface of the substrate, a lateral surface of the circuit element layer, and a lateral surface of the thin encapsulation layer that are adjacent to the through portion.