Flat Panel Display Touch Screen Pad Connection Using Conductive Balls
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Solution Overview
Problem
The integration of a touch screen into flat panel display devices complicates the designing and manufacturing processes due to the complexity of arranging and connecting sensing electrodes, conductive lines, and pads, leading to challenges in miniaturization, high resolution implementation, and increased manufacturing costs.
Innovation Solution
A flat panel display device design featuring a first film substrate with a display region and non-display region, a second film substrate with a touch sensor, and conductive balls of 5 μm to 15 μm diameter to electrically connect pads, allowing for reduced pad distances and uniform adhesive layer coating, facilitating miniaturization and reducing manufacturing expenses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional touch screen integration methods are used with multiple sensing electrodes, conductive lines, and pads, then touch functionality is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the touch sensor and display device into a single integrated structure where the touch sensor is formed on the same substrate as the display device. The sensing electrodes are integrated with the display structure, eliminating the need for separate touch screen components and reducing overall device complexity while maintaining touch functionality.
Solution Approach 2:
The patent implements multi-functionality by using the same substrate and electrode structures for both display and touch sensing functions. The display device serves dual purposes: visual output and touch input detection, thereby reducing the number of separate components and simplifying the overall device architecture.
2Reliability
If traditional pad connection methods are used, then electrical connections are established, but the distance between pads increases device size
Solution Approach 1:
The patent introduces conductive balls as intermediary elements to establish electrical connections between pads. These conductive balls serve as mediators that bridge the gap between pads on different substrates, enabling electrical connection while maintaining compact pad spacing and reducing overall device dimensions.
3Reliability
If larger conductive balls are used for pad connection, then electrical connection reliability improves, but manufacturing cost increases
Solution Approach 1:
The patent optimizes the parameters of conductive balls by precisely controlling their size, material composition, and distribution density. By adjusting these parameters, the patent achieves reliable electrical connections using smaller, more cost-effective conductive balls rather than larger, more expensive ones, thereby reducing manufacturing costs while maintaining connection reliability.
4Manufacturing precision
If uniform adhesive layer coating is implemented, then manufacturing precision improves, but process complexity increases
Solution Approach 1:
The patent applies preliminary actions by pre-treating the substrate surfaces before adhesive coating, including surface cleaning, activation, or priming. These preliminary steps prepare the surfaces to ensure uniform adhesive bonding without requiring complex real-time control during the coating process, thereby achieving high manufacturing precision while keeping the process relatively simple.
Data Source
AI summary
There is provided a flat panel display device and a method of manufacturing the same. A flexible and transparent material is coated on a supporting substrate to a small thickness so that film substrates are easily formed. Step differences are formed in the film substrates so that a distance between pads of the two film substrates is reduced. Since conductive balls with reduced diameters are used so that the pads may be electrically connected, the distance between pads is reduced so that it is possible to easily miniaturize a high resolution flat panel display device, to prevent electrical connection defect between the pads, and to reduce manufacturing expenses.