Display Transfer Bonding for Reliable Light Emitting Element Placement
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Solution Overview
Problem
The reliability of light emitting elements during the process of transferring and providing them on a display substrate is compromised, leading to potential deterioration.
Innovation Solution
A method involving aligning a metal layer of a transfer substrate with a display substrate, attaching a light emitting element with a metal protrusion portion to an overcoat layer, and separating the protrusion portion while maintaining the bond between the metal layer and the light emitting element, using a weaker bonding force to ensure reliable attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a light emitting element is transferred from a growth substrate to a display substrate, then the manufacturing process can be completed, but reliability deterioration occurs during the transfer process
Solution Approach 1:
The invention segments the transfer process into distinct stages: bonding the light emitting element to the transfer substrate, transferring to the display substrate, and separating the transfer substrate. This segmentation allows each stage to be optimized independently, with the bonding strength carefully controlled to ensure reliability during transfer while enabling clean separation afterward.
Solution Approach 2:
The transfer substrate serves as an intermediary carrier between the growth substrate and the display substrate. It temporarily holds the light emitting element during the transfer process, providing a stable platform that protects the element from damage while enabling controlled transfer and subsequent separation.
2Reliability
If the bonding force between metal protrusion portion and metal layer is strong, then the light emitting element remains attached during transfer, but separation from the transfer substrate becomes difficult
Solution Approach 1:
The invention applies local quality by creating different bonding characteristics at different locations and stages. The bonding force between the metal protrusion portion and metal layer is optimized to be sufficiently strong during transfer but controllable for separation. The insulative film provides localized protection and bonding control at specific areas of the light emitting element.
Solution Approach 2:
The bonding parameters (such as bonding force, temperature, or time) are carefully controlled and optimized to achieve the desired balance. The bonding strength is adjusted to be strong enough to maintain attachment during transfer but weak enough to allow clean separation afterward, transforming the bonding characteristics to serve different functions at different stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the reliability of the light emitting elements by maintaining the attachment to the overcoat layer while allowing for effective separation from the transfer substrate, improving the manufacturing process.
Implementation Method 1
a bonding force between the metal protrusion portion and the insulative film may be weaker than a bonding force between the metal protrusion portion and the metal layer
Implementation Method 2
an adhesive force between the light emitting element and the overcoat layer
Data Source
AI summary
In a method of manufacturing a display device, the method includes aligning a metal layer of a transfer substrate and a display substrate to face each other, attaching a light emitting element including a metal protrusion portion bonded to the metal layer to an overcoat layer of the display substrate by moving the transfer substrate relative to the display substrate, and separating the metal protrusion portion from the light emitting element by moving the transfer substrate relative to the display substrate.