Display Panel Transfer Member for Contamination-Free LED Bonding
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Solution Overview
Problem
The existing methods for fabricating display panels using inorganic light-emitting diodes face issues with contamination during the transfer process, particularly due to the direct contact of flux with the laser-transmitting member, leading to defective transfers and contamination risks.
Innovation Solution
A method involving a disposable transfer member with a detachable stamp layer and a protective film is employed to pick up light-emitting elements from a donor substrate, align them on a circuit board, and then remove the transfer member after bonding, preventing flux contact with the laser-transmitting member and minimizing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a reusable transfer member is used for transferring light-emitting elements, then the productivity is improved through repeated use, but the reliability deteriorates due to contamination accumulation on the transfer member
Solution Approach 1:
The patent employs a disposable transfer member that is discarded after a single use. This eliminates contamination accumulation issues inherent in reusable transfer members, ensuring high transfer quality for each operation. The transfer member includes a base layer and a stamp layer with adhesive material, designed for single-use transfer of light-emitting elements from donor substrate to circuit board.
2Manufacturing precision
If the transfer member remains in place during bonding, then the alignment is maintained, but the reliability deteriorates due to flux contamination of the laser-transmitting member
Solution Approach 1:
The patent performs the transfer operation before the bonding process, placing the light-emitting elements onto the circuit board in advance. The transfer member is then removed, preventing flux from contacting the laser-transmitting member during subsequent bonding operations. This preliminary transfer action maintains alignment accuracy while preventing contamination.
Solution Approach 2:
The patent extracts the transfer member from the system after completing its transfer function. By removing the transfer member before bonding occurs, the laser-transmitting member is protected from flux contamination. The transfer member serves its purpose of precise placement and is then discarded, separating the transfer function from the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively addresses the issue of contamination and defective transfers by ensuring the transfer member is removed post-bonding, maintaining cleanliness and preventing flux contact with the laser-transmitting member, thus enhancing the reliability and efficiency of the display panel fabrication process.
Implementation Method 1
The picking up transfer member includes picking up, by the transfer head, the transfer member by adsorbing the base layer
Implementation Method 2
an eutectic bonding by irradiating laser onto a bonding electrode at one end of the light-emitting element to melt the bonding electrode
Implementation Method 3
irradiating laser onto a bonding electrode at one end of the light-emitting element to melt the bonding electrode
Implementation Method 4
a soldering bonding by melting and bonding a solder ball between the light-emitting element and the circuit board
Implementation Method 5
an anisotropic conductive film (ACF) bonding by heating and bonding an anisotropic conductive film between the light-emitting element and the circuit board
Data Source
AI summary
The present disclosure may provide a method of fabricating a display panel, the method includes picking up, by a transfer head, a transfer member located on a support member, detaching a light-emitting element from a donor substrate by attaching the transfer member picked up by the transfer head to the light-emitting element on the donor substrate to lift the light-emitting element, aligning, by the transfer head, the light-emitting element attached to the transfer member on a circuit board, and detaching the transfer member from the transfer head, bonding the light-emitting element attached to the transfer member onto the circuit board and separating, by the transfer head, the transfer member from the light-emitting element bonded to the circuit board to remove the transfer member.